Thin film, method and apparatus for forming the same, and electronic component incorporating the same

Abstract

A method for forming a thin film includes the steps of: supplying a deposition material in the form of a liquid onto a heated surface; heating and vaporizing the deposition material on the heated surface while the deposition material is undergoing movement; and depositing the deposition material onto a deposition surface. The deposition material is supplied onto a position of the heated surface where the vaporized deposition material does not reach the deposition surface.

What is claimed is:  
     
       1. A thin film including an interface between a resin thin film and a metal thin film which are laminated, a concentration of oxygen in the vicinity of the interface between the resin thin film and the metal thin film is higher than a concentration of oxygen in a middle portion of the resin thin film in its thickness direction. 
     
     
       2. A thin film according to  claim 1 , wherein the concentration of oxygen in the vicinity of the interface is about 1.3 times or more the concentration of oxygen in a middle portion of the resin thin film in its thickness direction. 
     
     
       3. A thin film according to  claim 1 , wherein the resin thin film contains at least one acrylate monomer. 
     
     
       4. A thin film according to  claim 1 , wherein the resin thin film and the metal thin film are alternately laminated. 
     
     
       5. An electronic component having a thin film according to  claim 4 . 
     
     
       6. An electronic component according to  claim 5 , wherein the thickness of the metal thin film is in a range of about 50 nm to about 2000 nm, and the thickness of the resin thin film is in a range of about 0.05 to about 3 μm. 
     
     
       7. An electronic component according to  claim 6 , wherein a metal thin film is a strip-like thin film. 
     
     
       8. An electronic component according to  claim 6 , wherein the metal thin film comprises a layer made of different metal materials. 
     
     
       9. An electronic component according to  claim 7 , wherein the thickness of the metal thin film is in a range of about 15 to about 100 nm, and a thickness of a resin thin film is in a range of about 0.05 μm to about 1 μm. 
     
     
       10. A capacitor according to  claim 9 , wherein an outer-most layer of the resin thin film is thicker than the other resin thin film layers.