High frequency device packages and methods

Abstract

A high frequency device packing method and package are described wherein coaxial structures are formed from the high frequency device to the via. A coaxial via structure and a micro-coaxial bonding wire are described.

What is claimed is:  
     
       1. An electrical component package comprising: 
       an electrically conductive base having a coaxial via, the coaxial via including a center pin surrounded by an insulating ring such that the insulating ring electrically isolates the center pin from the rest of the base;  
       an electrical component mounted on a first surface of the base; and  
       a coaxial wire connecting the electrical component to the base, wherein the coaxial wire includes a wire capable of electrically coupling the electrical component to the center pin, an insulation layer surrounding the wire, and an electrically conductive shield coating the insulation layer.  
     
     
       2. The component package of  claim 1 , wherein the insulation layer is continuously deposited on the wire, the base, and the electronic component. 
     
     
       3. The component package of  claim 2 , wherein the conductive shield is conformally deposited on the insulation layer. 
     
     
       4. The component package of  claim 1  further comprising an opening in the insulation layer for exposing the base, wherein the deposited conductive shield fills the opening and becomes electrically coupled with the base. 
     
     
       5. The component package of  claim 1 , wherein the coaxial wire further comprises a tapered region at an end of the coaxial wire that is connected to the coaxial via to enhance the impedance matching characteristics between the coaxial wire and the coaxial via. 
     
     
       6. The component package of  claim 5 , wherein the tapered region further comprises an accumulation of conductive material where the coaxial wire connects to the coaxial via. 
     
     
       7. The component package of  claim 5 , further comprising a thicker coating of the insulation layer adjacent the tapered region. 
     
     
       8. The component package of  claim 1  further comprising a tin, layer deposited on a second surface of the base for protecting the insulating ring. 
     
     
       9. The component package of  claim 8 , wherein the tin layer is deposited on the center pin and over a part of the surrounding insulating ring. 
     
     
       10. The component package of  claim 9 , wherein the solder tin layer and the second surface form a substantially flat surface. 
     
     
       11. The component package of  claim 1 , wherein the base further comprises a material that is thermally matched with the electrical component. 
     
     
       12. A structure for packaging electrical components, the structure comprising: 
       an electrically conductive base material having at least one coaxial via, the coaxial via including a center pin surrounded by an insulating ring such that the insulating ring electrically isolates the center pin from the rest of the base material; and  
       a micro-coaxial wire extending fern the coaxial via, wherein the coaxial wire includes a wire, an insulation layer surrounding the wire, and an electrically conductive shield coating the insulation layer, and wherein the wire is electrically coupled to the center pin and the conductive shield is electrically coupled to the base to form a coaxial connection.  
     
     
       13. The structure of  claim 12 , wherein the insulation layer is continuously deposited on the wire, the base, and the electronic component, further comprising an opening in the insulation layer for exposing the base. 
     
     
       14. The structure of  claim 13 , wherein the shield is conformally deposited on the insulation layer and becomes electrically coupled to the base by filling the opening, such that the shield, the insulation layer, and the wire form the coaxial wire. 
     
     
       15. The structure of  claim 12 , wherein the coaxial wire comprises a tapered region at an end of the coaxial wire connected to the coaxial via. 
     
     
       16. The structure of  claim 15 , wherein the tapered transition comprises an accumulation of conductive material where the coaxial wire connects to the coaxial via. 
     
     
       17. The structure of  claim 16 , wherein the tapered transition further comprises a thicker coating of insulating material adjacent to the tapered region. 
     
     
       18. The structure of  claim 12 , wherein the coaxial we extends from a first surface of the base, further comprising a tin layer deposited on a second surface of the base and covering the center pin and a part of the insulating ring. 
     
     
       19. The structure of  claim 18 , wherein the second surface of the base forms a substantially flat surface. 
     
     
       20. The structure of  claim 12 , wherein the base further comprises a thermally conductive material. 
     
     
       21. An electrical device comprising: 
       an electrically conductive base having a coaxial via, the coaxial via including a center pin surrounded by an insulating ring such that the insulating ring electrically isolates the center pin from the rest of the base;  
       an electrical component mounted on a first surface of the base; and  
       a coaxial wire connecting the electrical component to the base, wherein the coaxial wire includes a wire for electrically coupling the electrical component to the center pin, an insulation layer surrounding the wire, and an electrically conductive shield coating the insulation layer, wherein the coaxial wire and the coaxial via maintain a substantially constant characteristic impedance connection from the electrical component to an outside connection point through the base.  
     
     
       22. The device of  claim 21 , wherein the insulation layer is continuously deposited on the wire, the base, and the electronic component. 
     
     
       23. The device of  claim 22 , wherein the conductive shield is conformally deposited on the insulation layer that is covering the wire, the base, and the electronic component. 
     
     
       24. The device of  claim 22  further comprising an opening in the insulation layer for exposing the base, wherein the conductive shield fills the opening and becomes electrically coupled with the base. 
     
     
       25. The device of  claim 21 , wherein the coaxial wire further comprises a tapered region at an end of the coaxial wire that is connected to the coaxial via to enhance the impedance matching characteristics between the coaxial wire and the coaxial via. 
     
     
       26. The device of  claim 25 , wherein the tapered region further comprises an accumulation of conductive material where the coaxial wire connects to the coaxial via. 
     
     
       27. The device of  claim 25 , further comprising a thicker coating of the insulation layer adjacent the tapered region. 
     
     
       28. The device of  claim 21  further comprising a tin layer deposited on a second surface of the base. 
     
     
       29. The device of  claim 28 , wherein the tin layer deposited on the second surface of the base is deposited on the center pin and over a part of the surrounding insulating ring. 
     
     
       30. The device of  claim 29 , wherein the tin layer and the second surface are substantially flat. 
     
     
       31. The device of  claim 21 , wherein the base further comprises a material that is thermally matched with the electrical component.