Hearing aid including an integrated circuit

Abstract

The invention relates to a hearing aid comprising a housing; a microphone; an integrated circuit; a receiver for outputting a signal; where the integrated circuit comprises at least one semiconductor layer including the electric circuit; the at least one layer having an outer circumference; at least one through electrical connection extending from one side of the at least one layer to an opposed other side of the at least one layer; the through electrical connection being established in distance from the outer circumference of the at least one layer. The invention further relates to an integrated circuit for use in a hearing aid as described above.

What is claimed is:  
     
       1. A hearing aid comprising: 
       housing;  
       a microphone;  
       an integrated circuit; and  
       a receiver for outputting a signal;  
       wherein the integrated circuit comprises;  
       at least one semiconductor layer including electric circuitry on a first side;  
       the at least one semiconductor layer having an outer circumference;  
       at least one through electrical connection extending from the first side of the at least one layer to an opposed second side of the at least one layer;  
       the through electrical connection being established a distance from the outer circumference of the at least one layer; and  
       wherein a redistribution layer is provided on the second side.  
     
     
       2. A hearing aid according to  claim 1 , wherein a redistribution layer is provided on the first side of the integrated circuit. 
     
     
       3. A hearing aid according to  claim 1 , wherein discrete electrical components are mounted on one side by means of solder pads in connection with the through electrical connections. 
     
     
       4. A hearing aid according to  claim 1 , wherein at least one connection pad is provided on one side of the integrated circuit. 
     
     
       5. A hearing aid according to  claim 4 , wherein at least one connection pad is provided on one side of the integrated circuit and discrete electrical components on the other side of the integrated circuit. 
     
     
       6. A hearing aid according to  claim 1 , wherein an EEPROM component is mounted on one side and solder balls are provided on the other side of the integrated circuit. 
     
     
       7. A hearing aid according to  claim 1 , wherein a micro-mechanical device is mounted on one side of the integrated circuit. 
     
     
       8. A hearing aid comprising: 
       a housing having a cavity and an interior surface;  
       a microphone;  
       an integrated circuit which is not connected to a base plate; and  
       a receiver for outputting a signal;  
       wherein the integrated circuit comprises;  
       at least one semiconductor layer including electric circuitry on a first side and a second side opposite the first side, said integrated circuit being mounted within said cavity and between said microphone and said receiver such that said second side faces the interior surface of the housing.  
     
     
       9. A hearing aid according to  claim 8 , including a protective coating on the second side. 
     
     
       10. An integrated circuit for a hearing aid, the integrated circuit comprising: 
       at least one semiconductor layer including electric circuitry on a first side;  
       the at least one semiconductor layer having an outer circumference;  
       at least one through electrical connection extending from the first side of the at least one layer to an opposed second side of the at least one layer;  
       the through electrical connection being established a distance from the outer circumference of the at least one layer  
       wherein a redistribution layer is provided on the second side.