Ground lead with integrated bushing apparatus and method

Abstract

A grounding device comprising a ground lead and a support bushing wherein the ground lead and the support bushing comprise a unitary structure.

What is claimed is:  
     
       1. A grounding device comprising: 
       a ground lead; and  
       a support bushing, wherein the ground lead and the support bushing form a single integral and gaplessly continuous piece, with said grounding device having opposing substantially rectangular members that are positioned under a ring of said ground lead, wherein said substantially rectangular members are shaped into substantially overlapping generally circular members, wherein the grounding device is integrated into a plastic housing, and wherein a printed circuit board is contained within the plastic housing.  
     
     
       2. The grounding device of  claim 1 , wherein the ground lead and the support bushing are blocked and formed from one piece of material and said substantially rectangular members are substantially equivalent. 
     
     
       3. The grounding device of  claim 1 , wherein said substantially rectangular members are bent under a ring of said ground lead. 
     
     
       4. The grounding device of  claim 1 , wherein the material is electrically conductive. 
     
     
       5. The grounding device of  claim 1 , wherein the plastic housing has one or more mounting pads extending from the housing and said mounting pads having an aperture, whereby said mounting pads provide bolting means for connection of the plastic housing to the grounding feature. 
     
     
       6. The grounding device of  claim 5 , wherein the support bushing is integrated into the plastic housing at a point where a bolt will be inserted through the mounting pads and the grounding device. 
     
     
       7. The grounding device of  claim 5 , wherein the mounting pads are internally supported by said support bushing and wherein said support bushing allows a bolt to pass through an aperture in the support bushing. 
     
     
       8. The grounding device of  claim 1 , wherein the grounding lead is integrated into the printed circuit board.