Adapter for surface mount devices to through hole applications

Abstract

An electrical adapter formed of a printed wiring board having opposing primary and secondary sides and at least one printed circuit having a plurality of solder pads arranged to interconnect with input/output signal pins of a surface mount technology (SMT) device and a plurality of plated vias arranged to interconnect with input/output signal pins of one or more discrete electrical components; one or more plated through holes extending between the primary and secondary sides of the board and electrically coupled to the printed circuit, the plated through holes being positioned in a pattern structured to match plated through holes in a parent circuit board; and a plurality of input/output signal interconnect pins mechanically and electrically coupled to the plated holes and extending a distance beyond the secondary side of the board.

What is claimed is:  
     
       1. An electrical adapter, comprising: 
       a printed wiring board having opposing primary and secondary sides and at least one printed circuit having a plurality of solder pads arranged to interconnect with input/output signal pins of a surface mount technology (SMT) device and a plurality of plated vias arranged to interconnect with input/output signal pins of one or more discrete electrical components;  
       one or more plated through holes extending between the primary and secondary sides of the board and electrically coupled to the printed circuit, the plated through holes being positioned in a pattern structured to match plated through holes in a parent circuit board; and  
       a plurality of input/output signal interconnect pins mechanically and electrically coupled to the plated holes and extending a distance beyond the secondary side of the board, the entirety of the input/output signal interconnect pins extending beyond the secondary side of the board being arranged in a circular pattern that is structured to imitate leads extending from a TO-type package.  
     
     
       2. The electrical adapter of  claim 1  wherein the printed wiring board further comprises at least a ground layer between the opposing primary and secondary sides. 
     
     
       3. The electrical adapter of  claim 2  wherein the printed wiring board further comprises at least one circuit layer between opposing primary and secondary sides, the circuit layer comprising the printed circuit. 
     
     
       4. The electrical adapter of  claim 1 , further comprising one or more SMT devices and one or more discrete components, whereby signal input to the electrical adapter generate output signals equivalent to a circuit housed in a TO-type package. 
     
     
       5. The electrical adapter of  claim 4  wherein one of the one or more SMT devices further comprises an oscillator. 
     
     
       6. An electrical device adapter, comprising: 
       a printed wiring board having a circuit layer and opposing primary and secondary sides;  
       a plurality solder pads arranged on the primary side of the printed wiring board to interconnect with input/output signal pins of a surface mount technology (SMT) device, the solder pads electrically interconnected to the circuit layer of the printed wiring board;  
       a plurality plated vias structured to accommodate one or more discrete electrical components and being electrically interconnected to the circuit layer of the board;  
       a plurality plated through holes extending between the primary and secondary sides and being electrically interconnected to the circuit layer of the board, the plated through holes being positioned in a pattern structured to match plated through holes in a parent circuit board; and  
       a plurality of elongated, interconnect pins inserted in respective ones of the plurality plated through holes and extending a distance from the secondary side of the printed wiring board, the interconnect pins being electrically and mechanically interconnected to the respective plated through holes and further the entirety of the interconnect pins extending from the secondary side of the printed wiring board being arranged in a circular pattern that is substantially identical to a known TO-type package.  
     
     
       7. The electrical device adapter of  claim 6  wherein the printed wiring board further comprises the circuit layer sandwiched between the opposing primary and secondary sides. 
     
     
       8. The electrical device adapter of  claim 6  wherein the printed wiring board further comprises a ground layer sandwiched between the opposing primary and secondary sides. 
     
     
       9. The electrical device adapter of  claim 6  wherein the plurality plated vias further comprises a plurality of plated through holes extending between the primary and secondary sides of the board. 
     
     
       10. The electrical adapter of  claim 6 , further comprising one or more SMT devices soldered to one or more of the plurality solder pads on the printed wiring board, the one or more SMT devices selected to generate a output signals equivalent to a circuit housed in TO-type package in response to a signal input to the electrical adapter. 
     
     
       11. The electrical adapter of  claim 10 , further comprising one or more discrete components soldered to one or more of the plated vias, the one or more discrete components selected to moderate one or more of the input and output signals of the one or more SMT devices. 
     
     
       12. The electrical adapter of  claim 11  wherein one of the SMT device further comprises an oscillator device. 
     
     
       13. The electrical adapter of  claim 12  wherein the one or more discrete components are selected from a group discrete components consisting of resistors, capacitors, and inductors. 
     
     
       14. An electrical device adapter, comprising: 
       a printed wiring board having at least a circuit layer and a ground layer between opposing primary and secondary sides;  
       a plurality surface mount technology (SMT) device solder pads arranged on the primary side of the printed wiring board to accommodate a plurality of input/output signal pins of a SMT device;  
       a plurality of plated vias electrically coupled between the solder pads and the circuit layer of the printed wiring board;  
       a first plurality plated through holes extending between the primary and secondary sides and being electrically interconnected to the circuit layer of the printed wiring board, different pairs of the first plurality of plated through holes being structured to accommodate different discrete electrical components;  
       a second plurality plated through holes extending between the primary and secondary sides and being electrically interconnected to the circuit layer of the printed wiring board, the second plurality of plated through holes being arranged in a circular pattern structured to imitate leads of a conventional TO-type device package; and  
       an elongated input/output signal interconnect pin soldered in two or more of the second plurality plated through holes and extending a distance from the secondary side of the printed wiring board.  
     
     
       15. The electrical device adapter of  claim 14  wherein the a plurality of plated vias electrically coupled between the solder pads and the circuit layer of the printed wiring board further comprises a third plurality of plated through holes extending between the primary and secondary sides and being electrically interconnected to the circuit layer of the printed wiring board. 
     
     
       16. The electrical device adapter of  claim 14  wherein the printed wiring board further comprises a single circuit layer and a single ground layer between the primary and secondary sides. 
     
     
       17. The electrical device adapter of  claim 14 , further comprising one or more SMT devices and one or more discrete components, whereby a signal input to the electrical adapter via one or more of the interconnect pins equivalent to input signal leads of an oscillator circuit housed in a TO-type device package generates an output signal on one or more different ones of the interconnect pins equivalent to output signal leads of an oscillator circuit housed in a TO-type device package that is equivalent to an oscillator circuit housed in a TO-type device package.