Method for fabricating ceramic chip packages

Abstract

Described is a method for fabricating ceramic chip packages in which an epoxy resin containing fine ceramic particles is applied on a ceramic substrate provided with chip packages respectively having a plurality of chips mounted thereon, thereby improving reliability and endurance of the package and miniaturizing the size of the package. The epoxy resin is applied on the ceramic substrate provided with a plurality of the chips mounted thereon except a designated region, thereby minimizing the deformation of the substrate. The epoxy resin layer is formed on the substrate by two steps including a first step for forming a first epoxy resin layer serving as a dam and a second step for forming a second epoxy resin layer, thereby reducing the amount of the used epoxy resin and improving reliability and endurance of the package against temperature and humidity.

What is claimed is:  
     
       1. A method for fabricating ceramic chip packages comprising the steps of: 
       (i) preparing a ceramic substrate provided with a plurality of chips mounted thereon;  
       (ii) forming an epoxy resin layer on the ceramic substrate except a designated region selected from an area without chips mounted thereon so as to cover the chips;  
       (iii) hardening the epoxy resin layer; and  
       (iv) dicing the ceramic substrate into a plurality of the packages.  
     
     
       2. The method for fabricating ceramic chip packages as set forth in  claim 1 , wherein the epoxy resin layer contains SiO 2 . 
     
     
       3. The method for fabricating ceramic chip packages as set forth in  claim 1 , wherein the epoxy resin layer has a uniform thickness and a flat upper surface. 
     
     
       4. The method for fabricating ceramic chip packages as set forth in  claim 1 , wherein the step (ii) comprises the sub-steps of: 
       forming a first epoxy resin layer on the ceramic substrate at the same thickness as the height of each of the chips mounted on the ceramic substrate; and  
       forming a second epoxy resin layer so as to cover the chips and the first epoxy resin layer.  
     
     
       5. The method for fabricating ceramic chip packages as set forth in  claim 4 , wherein the second epoxy resin layer is formed using an epoxy resin with a viscosity lower than that of the first epoxy resin. 
     
     
       6. The method for fabricating ceramic chip packages as set forth in  claim 4 , wherein the first epoxy layer serves as a dam. 
     
     
       7. The method for fabricating ceramic chip packages as set forth in  claim 1 , wherein the epoxy resin layer has a thickness of 200 to 350 μm. 
     
     
       8. The method for fabricating ceramic chip packages as set forth in  claim 1 , wherein the designated region without the epoxy resin layer is formed on the center of the ceramic substrate. 
     
     
       9. A method for fabricating ceramic chip packages comprising the steps of: 
       (i) preparing a ceramic substrate provided with a plurality of chips mounted thereon;  
       (ii) stacking on the ceramic substrate a dam member provided with openings corresponding to the packages of the ceramic substrate so that the packages of the ceramic substrate are exposed to the outside by the corresponding openings of the dam member;  
       (iii) forming an epoxy resin layer on the exposed upper surface of the packages from the dam member so as to cover a plurality of the chips;  
       (iv) hardening the epoxy resin layer; and  
       (v) dicing the ceramic substrate into a plurality of the packages.  
     
     
       10. The method for fabricating ceramic chip packages as set forth in  claim 9 , wherein the epoxy resin layer contains SiO 2 . 
     
     
       11. The method for fabricating ceramic chip packages as set forth in  claim 9 , wherein the epoxy resin layer has a uniform thickness and a flat upper surface. 
     
     
       12. The method for fabricating ceramic chip packages as set forth in  claim 9 , wherein the step (v) is characterized that the ceramic substrate is diced into a plurality of the packages, each package including the dam member attached to its edge. 
     
     
       13. The method for fabricating ceramic chip packages as set forth in  claim 9 , wherein the step (v) is characterized in that the ceramic substrate is diced into a plurality of the packages, each package not including the dam member attached to its edge. 
     
     
       14. The method for fabricating ceramic chip packages as set forth in  claim 9 , wherein the ceramic substrate is attached to the dam member by the epoxy resin layer. 
     
     
       15. The method for fabricating ceramic chip packages as set forth in  claim 9 , wherein a total thickness of the chip package is controlled by adjusting a thickness of the dam member. 
     
     
       16. The method for fabricating ceramic chip packages as set forth in  claim 9 , wherein protrusions and/or depressions are formed on the inner side walls of the openings of the dam member. 
     
     
       17. The method for fabricating ceramic chip packages as set forth in  claim 9 , wherein the dam member is formed by stacking a plurality of ceramic sheets formed by a punching method. 
     
     
       18. The method for fabricating ceramic chip packages as set forth in  claim 17 , wherein the ceramic sheets are attached to each other using the epoxy resin. 
     
     
       19. The method for fabricating ceramic chip packages as set forth in  claim 9 , wherein the dam member is made of a ceramic material. 
     
     
       20. The method for fabricating ceramic chip packages as set forth in  claim 9 , wherein the dam is made of a molded organic substance. 
     
     
       21. The method for fabricating ceramic chip packages as set forth in  claim 9 , wherein the dam is made of a metal material.