Electronic component and method of producing the same

Abstract

An electronic component includes a laminate having a structure in which an element substrate and a sealing substrate are bonded to each other through an adhesive layer, a terminal electrode is arranged on the element substrate so as to be exposed at an end surface of the laminate, an outside electrode is disposed on the outer surface of the sealing substrate, the terminal electrode and the outside electrode are electrically connected to each other through an end surface electrode disposed on the end surface of the laminate, and the thickness of the end surface electrode is between about one half of the thickness of the adhesive layer and about five times of the thickness thereof.

1. An electronic component comprising:
 an element substrate having an electronic component element disposed therein;  
 an adhesive layer disposed on at least one surface of the element substrate;  
 a sealing substrate bonded to the element substrate through the adhesive layer;  
 a terminal electrode disposed on the surface of the element substrate adjacent to the adhesive layer so as to be exposed at an end surface of a laminate including the element substrate, the adhesive layer, and the sealing substrate;  
 an outside electrode disposed on the outer surface of the sealing substrate; and  
 an end surface electrode disposed on the end surface of the laminate;  
 wherein a thickness of the end surface electrode is between about one half of the thickness of the adhesive layer and about five times of the thickness of the adhesive layer.  
 
   
   
     2. An electronic component according to  claim 1 , further comprising another adhesive layers disposed on a surfaces of the element substrate that is opposed to the at least one surface, and another sealing substrate that is bonded to the surfaces of the element substrate that is opposed to the at least one surface. 
   
   
     3. An electronic component according to  claim 1 , wherein the element substrate includes an energy trap piezoelectric resonating portion. 
   
   
     4. An electronic component according to  claim 3 , wherein the energy trap piezoelectric resonating portion vibrates in a thickness longitudinal vibration mode. 
   
   
     5. An electronic component according to  claim 3 , wherein cavities are provided in the element substrate to allow for unhindered vibration of the energy trap piezoelectric resonating portion. 
   
   
     6. An electronic component according to  claim 1 , wherein the element substrate is made of one of a piezoelectric ceramic and a piezoelectric single crystal. 
   
   
     7. An electronic component according to  claim 6 , wherein the element substrate is polarized in a thickness direction thereof. 
   
   
     8. An electronic component according to  claim 1 , wherein the element substrate includes at least two resonating portions. 
   
   
     9. An electronic component according to  claim 1 , wherein the element substrate, the terminal electrode, the outside electrode and the end surface electrode are arranged to define a three-terminal piezoelectric filter having relay capacities. 
   
   
     10. An electronic component according to  claim 1 , wherein the outside electrode and the terminal electrode extend out to a common end surface of the laminate. 
   
   
     11. An electronic component according to  claim 1 , wherein the end surface electrode includes an undercoat electrode. 
   
   
     12. An electronic component according to  claim 1 , wherein at least two of the end surface electrodes are provided on end surfaces of the laminate and each of the at least two end surface electrodes has a thickness that is between about one half of the thickness of the adhesive layer and about five times of the thickness of the adhesive layer.