US6849072B2ExpiredUtilityPatentIndex 86
Methods and apparatus for thermally affecting tissue
Est. expiryApr 7, 2020(expired)· nominal 20-yr term from priority
A61F 2007/0095A61F 2007/0069A61F 2007/126A61F 7/12A61F 2007/0063A61B 2090/064A61F 2007/0056A61B 2017/00867
86
PatentIndex Score
28
Cited by
64
References
16
Claims
Abstract
Methods and apparatus are provided for thermally affecting tissue via either a closed or open device. In each of the closed device embodiments, thermally transmissive fluid is circulated and distributed through into a device, an outer surface of which is in direct thermal contact with a region of tissue to thermally affect the tissue. In each of the open device embodiments, thermally transmissive fluid is circulated through a device and systematically deployed directly onto a region of tissue to irrigate, and, therefore, thermally affect the tissue.
Claims
exact text as granted — not AI-modified1. An apparatus for thermally affecting brain tissue, comprising:
an implantable member having an outer surface configurable to contact target brain tissue;
at least one fluid-tight lumen defined by the implantable member, the fluid-tight lumen being in thermal communication with the outer surface of the implantable member and being configured to receive a thermally transmissive cooling fluid to thereby impart a thermal change to the outer surface of the implantable member;
a first temperature sensing element that is effective to measure the temperature of the target tissue; and
a pressure measurement element having a first end positioned in proximity to the implantable member and effective to measure the pressure at which the implantable member is applied to the target tissue,
whereby the implantable member is adapted for thermally transmissive contact with epidural brain tissue.
2. The apparatus of claim 1 , wherein the thermally transmissive cooling fluid is selected from the group consisting of liquid, gas and a combination thereof.
3. The apparatus of claim 1 , wherein the implantable member has a shape selected from the group consisting of substantially circular, substantially elliptical, substantially oval, substantially square, substantially trapezoidal and substantially rhomboid.
4. The apparatus of claim 3 , wherein at least a portion of the implantable member is looped around itself to approximately resemble a coil shape.
5. The apparatus of claim 1 , wherein the implantable member is formed from a flexible, thermally conductive, biocompatible material.
6. The apparatus of claim 5 , wherein the implantable member is formed from a silicone elastomer.
7. The apparatus of claim 1 , wherein the implantable member is adapted for direct thermally transmissive contact with subdural brain tissue.
8. The apparatus of claim 1 , further comprising:
a backing member attached to the implantable member such that the backing member is in thermal contact with the tissue.
9. The apparatus of claim 8 , wherein the backing member is made of a thermally transmissive material, the thermally transmissive material being resistant to adherence to the tissue.
10. The apparatus of claim 9 , wherein the backing member is made of silicone.
11. The apparatus of claim 1 , further comprising:
a second temperature measurement element positioned within the lumen and effective to measure the temperature of any fluid within the lumen.
12. The apparatus of claim 1 , wherein the pressure indication element is in communication with a warning indicator such that the warning indicator is effective to produce a signal upon the measurement of a predetermined pressure level by the pressure measurement element.
13. The apparatus of claim 12 , wherein the signal is selected from the group consisting of a visual signal, an audio signal, and a combination thereof.
14. The apparatus of claim 1 , wherein the implantable member is constructed of a shape memory material.
15. The apparatus of claim 1 , wherein the first temperature sensing element is positioned on a tissue-contacting portion of the implantable member.
16. The apparatus of claim 8 , wherein the first temperature sensing element is positioned on the backing member.Cited by (0)
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