P
US6953989B2ExpiredUtilityPatentIndex 69

Film carrier tape for mounting electronic devices thereon and final defect marking method using the same

Assignee: MITSUI MINING & SMELTING COPriority: Jan 28, 2003Filed: Jan 28, 2004Granted: Oct 11, 2005
Est. expiryJan 28, 2023(expired)· nominal 20-yr term from priority
Inventors:KIRIYAMA TATSUYA
H10W 70/655H10W 46/601H10W 70/453H10W 46/00H05K 1/0266H05K 3/225H05K 1/0393H05K 3/005H05K 2203/1545H05K 2201/09781
69
PatentIndex Score
6
Cited by
3
References
16
Claims

Abstract

A film carrier tape for mounting electronic devices thereon having a mounting unit in which a wiring pattern is formed by etching on a base material, wherein the mounting unit has a target mark to be a reference of an alignment for carrying out final defect marking in a target position on the mounting unit by marking means as a pattern formed on the base material by the etching, and a defect marking method using the same are provided.

Claims

exact text as granted — not AI-modified
1. A film carrier tape for mounting electronic devices thereon having a mounting unit in which a wiring pattern is formed by etching on a base material,
 wherein the mounting unit has a target mark to be a reference of an alignment for carrying out final defect marking in a target position on the mounting unit by marking means as a pattern formed on the base material by the etching.  
 
     
     
       2. The film carrier tape for mounting electronic devices thereon according to  claim 1 , wherein the target mark is not electrically connected to the wiring pattern. 
     
     
       3. The film carrier tape for mounting electronic devices thereon according to  claim 1 , wherein the target mark is formed to be clearly indicated by a wiring shape of the wiring pattern. 
     
     
       4. The film carrier tape for mounting electronic devices thereon according to  claim 1 , wherein the target mark takes an almost identical shape to a marking shape of the marking means. 
     
     
       5. The film carrier tape for mounting electronic devices thereon according to  claim 1 , wherein the target mark is formed in an optional position A 2  on a base material which is placed apart from a target position A 1  for execution of final defect marking and is not provided with a wiring pattern, and
 an optional position A 2 ′ on a base material which is not provided with the wiring pattern over a line which is perpendicular to a line connecting the positions A 1  and A 2  and passes through the position A 1  or a position A 2 ″ which is not provided with the wiring pattern on a projection of the position A 2  with respect to the position A 1 .  
 
     
     
       6. The film carrier tape for mounting electronic devices thereon according to  claim 1 , wherein the mounting unit does not have a device hole. 
     
     
       7. A film carrier tape for mounting electronic devices thereon which has a plurality of mounting units provided with a wiring pattern by etching on a base material and is subjected to a final defect marking step,
 wherein the mounting units decided to be normal at a quality inspecting step have target marks formed in predetermined positions on the units as a pattern formed by the etching so as to be a reference of an alignment for carrying out final defect marking in target positions on the units by marking means if the units are decided to be defective at the quality inspecting step, and  
 the mounting units decided to be defective at the quality inspecting step have final defect marking carried out in predetermined positions based on the target marks.  
 
     
     
       8. The film carrier tape for mounting electronic devices thereon according to  claim 7 , wherein the mounting unit does not have a device hole. 
     
     
       9. A final defect marking method of a film carrier tape for mounting electronic devices thereon having a mounting unit provided with a wiring pattern by etching on a base material which serves to carry out final marking on the mounting unit decided to be defective at a quality inspecting step,
 wherein defect marking is carried out in a marking position determined by aligning marking means with the mounting unit based on a position of a target mark formed as a pattern on the base material by the etching.  
 
     
     
       10. The final defect marking method of a film carrier tape for mounting electronic devices thereon according to  claim 9 , wherein the mounting unit does not have a device hole. 
     
     
       11. The film carrier tape for mounting electronic devices thereon according to  claim 2 , wherein the target mark takes an almost identical shape to a marking shape of the marking means. 
     
     
       12. The film carrier tape for mounting electronic devices thereon according to  claim 3 , wherein the target mark takes an almost identical shape to a marking shape of the marking means. 
     
     
       13. The film carrier tape for mounting electronic devices thereon according to  claim 2 , wherein the mounting unit does not have a device hole. 
     
     
       14. The film carrier tape for mounting electronic devices thereon according to  claim 3 , wherein the mounting unit does not have a device hole. 
     
     
       15. The film carrier tape for mounting electronic devices thereon according to  claim 4 , wherein the mounting unit does not have a device hole. 
     
     
       16. The film carrier tape for mounting electronic devices thereon according to  claim 5 , wherein the mounting unit does not have a device hole.

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