Wiring board having interconnect pattern with land, and semiconductor device, circuit board, and electronic equipment incorporating the same

Abstract

A wiring board includes a substrate, and an interconnect pattern which is formed on the substrate and includes a land. A penetration hole, which exposes the substrate, is formed in the land. The penetration hole is formed in a region along a periphery of the land.

1. A wiring board comprising:
 a substrate; 
 an interconnect pattern which is formed on the substrate and includes a land having a penetration hole; and 
 a resist layer covering at least the penetration hole, the penetration hole being formed in a region along a periphery of the land. 
 
     
     
       2. The wiring board as defined in  claim 1 , wherein a planar shape of the land is approximately circular. 
     
     
       3. The wiring board as defined in  claim 1 , wherein the penetration hole is an elongated hole exposing the substrate. 
     
     
       4. The wiring board as defined in  claim 3 , wherein the penetration hole is the elongated hole which is longer in a direction along the periphery of the land than in a direction intersecting the periphery of the land at right angles. 
     
     
       5. The wiring board as defined in  claim 1 , wherein a plurality of the penetration holes are formed in the land. 
     
     
       6. The wiring board as defined in  claim 5 , wherein the plurality of penetration holes are arranged in a region along the periphery of the land. 
     
     
       7. The wiring board as defined in  claim 5 , wherein the plurality of penetration holes are disposed so that distance between the adjacent penetration holes is approximately the same. 
     
     
       8. The wiring board as defined in  claim 1 , further comprising:
 the resist layer being formed on a surface of the substrate on which the interconnect pattern is formed and includes an opening which exposes at least a part of the land. 
 
     
     
       9. The wiring board as defined in  claim 8 , wherein a planar shape of the opening of the resist layer is approximately circular. 
     
     
       10. The wiring board as defined in  claim 8 , wherein the resist layer covers at least a part of the penetration hole. 
     
     
       11. The wiring board as defined in  claim 8 ,
 wherein the resist layer covers the penetration hole, and 
 wherein part of an edge of the penetration hole is in contact with an edge of the opening of the resist layer. 
 
     
     
       12. The wiring board as defined in  claim 1 , which is formed as an interposer. 
     
     
       13. The wiring board as defined in  claim 1 , which is formed as a motherboard. 
     
     
       14. A semiconductor device comprising:
 the wiring board as defined in  claim 1 , and 
 a semiconductor chip which is electrically connected with the interconnect pattern. 
 
     
     
       15. The semiconductor device as defined in  claim 14 , further comprising an external terminal formed on the land. 
     
     
       16. A circuit board on which the semiconductor device as defined in  claim 14  is mounted. 
     
     
       17. Electronic equipment comprising the semiconductor device as defined in  claim 14 .