Backlight module and heat dissipation structure thereof

Abstract

A backlight module and heat dissipation structure thereof. The heat dissipation structure is used for a backlight module which comprises a circuit board having a through hole with a light emitting diode (LED) corresponding thereto and disposed on one side of the circuit board. The heat dissipation structure comprises a heat conducting portion thermo-conductively connected to the LED and positioned in the through hole, a thermal conductive element disposed between the heat conducting portion and the LED, and a heat dissipating portion thermo-conductively connected to the heat conducting portion. Heat from the LED is conducted through the thermal conductive element and the heat conducting portion to the heat dissipation portion.

1. A heat dissipation structure for a backlight module comprising a circuit board having a through hole with a light emitting diode (LED) corresponding thereto, disposed on one side of the circuit board, comprising:
 a heat conducting portion thermo-conductively connected to the LED and positioned in the through hole; 
 a thermal conductive element disposed between the heat conducting portion and the LED, the thermal conducting element being made of a soft material that is not damaging to the LED; and 
 a heat dissipating portion thermo-conductively connected to the heat conducting portion. 
 
   
   
     2. The heat dissipation structure as claimed in  claim 1 , wherein the thermal conductive element contacts the heat conducting portion and the LED. 
   
   
     3. The heat dissipation structure as claimed in  claim 2 , wherein the thermal conductive element comprises a thermal conductive pad. 
   
   
     4. The heat dissipation structure as claimed in  claim 2 , wherein the thermal conductive element comprises a layer of thermal conductive paste. 
   
   
     5. The heat dissipation structure as claimed in  claim 1 , wherein the heat conducting portion and the heat dissipating portion are integrally formed. 
   
   
     6. The heat dissipation structure as claimed in  claim 1 , wherein the heat conducting portion comprises a heat conducting column. 
   
   
     7. The heat dissipation structure as claimed in  claim 1 , wherein the heat dissipation portion comprises a heat dissipation plate. 
   
   
     8. The heat dissipation structure as claimed in  claim 1 , wherein the heat conducting portion and the heat dissipation portion are made of metal. 
   
   
     9. The heat dissipation structure as claimed in  claim 1 , wherein the heat conducting portion and the heat dissipation portion are made of engineering plastic. 
   
   
     10. A backlight module, comprising:
 a housing; 
 a circuit board having a plurality of through holes and disposed on the housing; 
 a plurality of light emitting diodes (LEDs) corresponding to the through holes and disposed on and electrically connected to the circuit board; 
 a plurality of heat conducting portions thermo-conductively connected to the LEDs and disposed in the through holes; 
 a plurality of thermal conductive elements disposed in the through hole and sandwiched between the LEDs and the heat conducting portions; and 
 at least one heat dissipation portion thermo-conductively connected to the heat conducting portions and positioned between the circuit board and the housing. 
 
   
   
     11. The backlight module as claimed in  claim 10 , wherein the heat dissipation portion contacts the housing. 
   
   
     12. The backlight module as claimed in  claim 10 , wherein the thermal conductive element contacts the heat conducting portion and the LED. 
   
   
     13. The backlight module as claimed in  claim 12 , wherein the thermal conductive element comprises a thermal conductive pad. 
   
   
     14. The backlight module as claimed in  claim 12 , wherein the thermal conductive element comprises a layer of thermal conductive paste. 
   
   
     15. The backlight module as claimed in  claim 10 , wherein the heat conducting portion and the heat dissipating portion are integrally formed. 
   
   
     16. The backlight module as claimed in  claim 10 , wherein the heat conducting portion comprises a heat conducting column. 
   
   
     17. The backlight module as claimed in  claim 10 , wherein the heat dissipation portion comprises a heat dissipation plate. 
   
   
     18. The backlight module as claimed in  claim 10 , wherein the heat conducting portion and the heat dissipation portion are made of metal. 
   
   
     19. The backlight module as claimed in  claim 10 , wherein the heat conducting portion and the heat dissipation portion are made of engineering plastic.