Method for precise molding and alignment of structures on a substrate using a stretchable mold

Abstract

A method for molding and aligning microstructures on a patterned substrate using a microstructured mold. A slurry containing a mixture of a ceramic powder and a curable fugitive binder is placed between the microstructure of a stretchable mold and a patterned substrate. The mold can be stretched to align the microstructure of the mold with a predetermined portion of the patterned substrate. The slurry is hardened between the mold and the substrate. The mold is then removed to leave microstructures adhered to the substrate and aligned with the pattern of the substrate. The microstructures can be thermally heated to remove the binder and optimally fired to sinter the ceramic powder.

What is claimed is: 
     
       1. An electronic display assembly comprising a glass substrate, a plurality of independently addressable electrodes patterned on the glass substrate, and a plurality of ceramic barriers molded and aligned on the glass substrate wherein the ceramic barriers and the electrodes each have a pitch with a mismatch of no greater than 0.01% wherein the assembly is prepared by a process comprising:
 providing a mixture comprising a ceramic powder disposed in a curable binder; 
 placing the mixture between the glass substrate and a patterned surface of a mold; 
 stretching the mold to align a portion of the patterned surface of the mold with the electrodes of the glass substrate; 
 curing the curable binder to a rigid state such that the binder is adhered to the glass substrate; and removing the mold. 
 
     
     
       2. The electronic display assembly of  claim 1 , wherein the step of placing the mixture between the glass substrate and the patterned surface of the mold comprises coating the glass substrate with the mixture and bringing the patterned surface of the mold in contact with the mixture. 
     
     
       3. The electronic display assembly of  claim 1 , wherein the step of curing forms hardened material comprising microstructures that substantially replicate the patterned surface of the mold. 
     
     
       4. The electronic display assembly of  claim 3 , wherein the hardened material further comprises a land between the structures and the substrate. 
     
     
       5. The electronic display assembly of  claim 1 , wherein the ceramic barriers comprise a series of substantially parallel ridges. 
     
     
       6. The electronic display assembly of  claim 5 , wherein the step of stretching the mold comprises mechanically expanding the mold in a direction parallel to the ridges. 
     
     
       7. The electronic display assembly of  claim 5 , wherein the step of stretching the mold comprises mechanically expanding the mold in a direction perpendicular to the ridges. 
     
     
       8. The electronic display assembly of  claim 1 , wherein the step of stretching the mold comprises mechanically pulling the mold in a single direction lateral to the glass substrate. 
     
     
       9. The electronic display assembly of  claim 1 , wherein the step of stretching the mold comprises heating the mold in a substantially uniform fashion to thereby expand the mold. 
     
     
       10. The electronic display assembly of  claim 1 , wherein the step of curing the curable binder comprises exposing the slurry to ultraviolet or visible light radiation through the substrate, through the mold, or through both the substrate and the mold. 
     
     
       11. A high definition television screen assembly including a plasma display panel comprising:
 a back glass substrate having a plurality of independently addressable electrodes forming a pattern; 
 a plurality of ceramic microstructured barriers molded and aligned with the electrode pattern on the back substrate wherein the ceramic barriers and electrodes each have a pitch with a mismatch of no greater than 0.0 1% and the panel is prepared according to a process comprising 
 providing a mixture comprising a ceramic powder disposed in a curable binder, 
 placing the mixture between the glass substrate and a patterned surface of a mold, 
 stretching the mold to align a portion of the patterned surface of the mold with the electrodes of the glass substrate, 
 curing the curable binder to a rigid state such that the binder is adhered to the glass substrate, and removing the mold; 
 phosphor powder deposited between the ceramic barriers; a front glass substrate having a plurality of electrodes, the front substrate mounted with its electrodes facing the electrodes on the back substrate; and 
 an inert gas disposed between the front and back substrates. 
 
     
     
       12. The television screen of  claim 11 , wherein the step of curing forms hardened material comprising microstructures that substantially replicate the patterned surface of the mold. 
     
     
       13. The television screen of  claim 12 , wherein the hardened material further comprises a land between the structures and the substrate. 
     
     
       14. The television screen of  claim 11 , wherein the ceramic barriers comprise a series of substantially parallel ridges. 
     
     
       15. The television screen of  claim 14 , wherein the step of stretching the mold comprises mechanically expanding the mold in a direction parallel to the ridges. 
     
     
       16. The television screen of  claim 15 , wherein the step of stretching the mold comprises mechanically expanding the mold in a direction perpendicular to the ridges. 
     
     
       17. The television screen of  claim 11 , wherein the step of stretching the mold comprises mechanically pulling the mold in a single direction lateral to the glass substrate. 
     
     
       18. The television screen of  claim 11 , wherein the step of stretching the mold comprises heating the mold in a substantially uniform fashion to thereby expand the mold. 
     
     
       19. The television screen of  claim 11 , wherein the step of curing the curable binder comprises exposing the slurry to ultraviolet or visible light radiation through the substrate, through the mold, or through both the substrate and the mold.