Optoelectronic sensor device

Abstract

An optoelectronic sensor device for detecting precipitation on an outer surface of a transparent pane. The sensor device includes a beam guide attached to an inner surface of the pane and a circuit board offset from the inner pane surface. A beam transmitter is arranged on the circuit board to transmit, along a transmission beam path, a light beam toward the pane via the beam guide. A beam receiver is arranged on the circuit board to receive, along a reception beam path, a light beam reflected from the outer surface of the pane via the beam guide. A circuit substrate, electrically connected to the circuit board, is arranged parallel to the pane between the pane and the circuit board. An installation space separates the circuit substrate from the inner pane surface. A heating device is arranged on the circuit substrate in an area lying outside of the beam paths.

1. An optoelectronic sensor device for detecting precipitation on an outer surface of a transparent pane, the device comprising:
 a beam guide body attached to an inner surface of the pane;  
 a circuit board spaced apart from the inner surface of the pane;  
 wherein the beam guide body is positioned between the inner surface of the pane and the circuit board;  
 a beam transmitter arranged on the circuit board to transmit, along a transmission beam path, a light beam toward the pane via the beam guide body;  
 a beam receiver arranged on the circuit board to receive, along a reception beam path, a light beam reflected from the pane via the beam guide body;  
 a circuit substrate arranged parallel to the pane and in an area lying outside of the transmission and reception beam paths, the circuit substrate positioned between the beam guide body and the circuit board, the circuit substrate being spaced apart from the circuit board and being electrically connected to the circuit board to receive electrical current from the circuit board, the circuit substrate being separated from the beam guide body by an installation space; and  
 a heating device arranged on the circuit substrate in an area lying outside of the transmission and reception beam paths, wherein the circuit substrate provides the electrical current received from the circuit board to the heating device, wherein the heating device converts the electrical current to heat.  
 
   
   
     2. The device of  claim 1  wherein:
 the heating device is a balanced and self-regulating positive temperature coefficient system placed on the circuit substrate.  
 
   
   
     3. The device of  claim 1  wherein:
 the heating device is a resistance element.  
 
   
   
     4. The device of  claim 3  wherein:
 the resistance element is a thick film print structure arranged on a side of the circuit substrate which faces the circuit board.  
 
   
   
     5. The device of  claim 3  wherein:
 the resistance element includes surface mount device resistors.  
 
   
   
     6. The device of  claim 1  wherein:
 the circuit substrate is one of a circuit board and a ceramic substrate.  
 
   
   
     7. The device of  claim 1  further comprising:
 at least one additional electronic component arranged on the circuit substrate within the installation space between the circuit substrate and the inner surface of the pane.  
 
   
   
     8. The device of  claim 7  wherein:
 the at least one additional electrical component is a temperature measurement component.  
 
   
   
     9. The device of  claim 8  wherein:
 the temperature measurement component is a structure printed on the circuit substrate.  
 
   
   
     10. The device of  claim 7  wherein:
 the at least one additional electrical component is a beam sensor.  
 
   
   
     11. The device of  claim 10  wherein:
 the beam sensor is associated with a laser trimmable resistor printed on the circuit substrate.  
 
   
   
     12. A method for detecting precipitation on an outer surface of a transparent pane, the method comprising:
 attaching a beam guide body to an inner surface of the pane;  
 attaching a circuit board to the beam guide body such that the circuit board is spaced apart from the inner surface of the pane and such that the beam guide body is positioned between the inner surface of the pane and the circuit board;  
 arranging a beam transmitter on the circuit board to transmit, along a transmission beam path, a light beam toward the pane via the beam guide body;  
 arranging a beam receiver on the circuit board to receive, along a reception beam path, a light beam reflected from an outer surface of the pane via the beam guide body;  
 arranging a circuit substrate parallel to the pane and in an area lying outside of the transmission and reception beam paths and positioning the circuit substrate between the beam guide body and the circuit board such that the circuit substrate is separated from the beam guide body by an installation space and is spaced apart from the circuit board;  
 electrically connecting the circuit substrate to the circuit board to receive electrical current from the circuit board;  
 arranging a heating device on the circuit substrate in an area lying outside of the transmission and reception beam paths; and  
 providing electrical current from the circuit board to the heating device via the circuit substrate for the heating device to use in order to generate heat.  
 
   
   
     13. The method of  claim 12  wherein:
 the heating device is a resistance element.  
 
   
   
     14. The method of  claim 13  wherein:
 arranging the heating device on the circuit substrate includes printing the resistance element on a side of the circuit substrate which faces the circuit board.  
 
   
   
     15. The method of  claim 12  further comprising:
 arranging at least one additional electronic component on the circuit substrate within the installation space between the circuit substrate and the inner surface of the pane.  
 
   
   
     16. The method of  claim 15  wherein:
 the at least one additional electrical component is a temperature measurement component, and arranging the temperature measurement component on the circuit substrate within the installation space includes printing the temperature measurement component on a side of the circuit substrate facing the inner surface of the pane.  
 
   
   
     17. The method of  claim 15  wherein:
 the at least one additional electrical component is a beam sensor.  
 
   
   
     18. An optoelectronic sensor device for detecting precipitation on an outer surface of a transparent pane, the device comprising:
 a beam guide body attached to an inner surface of the pane;  
 a first circuit board spaced apart from the inner surface of the pane;  
 wherein the beam guide body is positioned between the inner surface of the pane and the first circuit board;  
 a beam transmitter arranged on the first circuit board to transmit, along a transmission beam path, a light beam toward the pane via the beam guide body;  
 a beam receiver arranged on the first circuit board to receive, along a reception beam path, a light beam reflected from the pane via the beam guide body;  
 a second circuit board arranged parallel to the pane and in an area lying outside of the transmission and reception beam paths, the second circuit board positioned between the beam guide body and the first circuit board, the second circuit board being spaced apart from the first circuit board and being electrically connected to the first circuit board to receive electrical current from the first circuit board, the second circuit board being separated from the beam guide body by an installation space; and  
 a heating device arranged on the second circuit board in an area lying outside of the transmission and reception beam paths, wherein the second circuit board provides the electrical current received from the first circuit board to the heating device, wherein the heating device converts the electrical current to heat.  
 
   
   
     19. The device of  claim 18  wherein:
 the heating device is arranged on a side of the second circuit board which faces the first circuit board.  
 
   
   
     20. The device of  claim 19  further comprising:
 at least one additional electronic component arranged on a side of the second circuit board which faces the inner surface of the panel, wherein the at least one additional electronic component includes at least one of a temperature measurement component and a beam sensor.