Method for forming micro groove structure

Abstract

A method of forming a micro groove structure according to the invention has the steps of: (a) forming a mask pattern on a substrate capable of being subjected to dry etching; (b) dry etching the substrate having the mask pattern formed thereon; (c) vapor-phase forming a thin film of a masking material for the dry etching, on a non-etched surface portion of the substrate after the dry etching; and (d) dry etching the substrate having the thin film formed thereon. The steps (a) to (d) are carried out successively.

1. A method of forming a micro groove structure, comprising the steps of:
 (a) forming a mask pattern on a substrate capable of being subjected to dry etching; 
 (b) first dry etching said substrate having said mask pattern formed thereon; 
 (c) vapor-phase forming a thin film of a masking material for subsequent dry etching, on a non-etched surface portion of said substrate after said first dry etching; and 
 (d) next dry etching said substrate having said thin film formed thereon, wherein after the steps (a) to (d) are carried out successively, the steps (c) and (d) are repeated successively one or more times. 
 
     
     
       2. A method of forming a micro groove structure according to  claim 1 , wherein the step (c) is carried out in such way that particles of masking material forming said thin film are obliquely deposited on said substrate. 
     
     
       3. A method of forming a micro groove structure according to  claim 1 , wherein said substrate has a multilayer film structure. 
     
     
       4. A method of forming a micro groove structure according to  claim 1 , wherein the step (c) is carried out in such way that particles of masking material forming said thin film are obliquely deposited to the substrate due to a baffle being disposed in front of said substrate when particles of masking material forming said thin film are deposited on said substrate. 
     
     
       5. A method of forming a micro groove structure according to  claim 1 , wherein an angle of incidence of particles of masking material to a surface of said substrate is substantially larger than an angle at which the particles reach a portion of the substrate to be etched in the step (d). 
     
     
       6. A method of forming a micro groove structure, comprising the steps of:
 (a) forming a mask pattern on a substrate capable of being subjected to dry etching; 
 (b) first dry etching said substrate having said mask pattern formed thereon; 
 c) vapor-phase forming a thin film of a masking material for subsequent dry etching, on a non-etched surface portion of said substrate after said first dry etching; and 
 (d) next dry etching said substrate having said thin film formed thereon, wherein said mask pattern formed in the step (a) is a pattern of straight lines periodic in one direction or in two directions in a plane of said substrate. 
 
     
     
       7. A method of forming a micro groove structure, comprising the steps of:
 (a) forming a mask pattern on a substrate capable of being subjected to dry etching; 
 (b) first dry etching said substrate having said mask pattern formed thereon; 
 c) vapor-phase forming a thin film of a masking material for subsequent dry etching, on a non-etched surface portion of said substrate after said first dry etching; and 
 (d) next dry etching said substrate having said thin film formed thereon, wherein inductive coupling plasma reactive ion etching is used in the steps (b) and (d). 
 
     
     
       8. A method of forming a micro groove structure, comprising the steps of:
 (a) forming a mask pattern on a substrate capable of being subjected to dry etching; 
 (b) first dry etching said substrate having said mask pattern formed thereon; 
 (c) vapor-phase forming a thin film by sputtering particles of a masking material for subsequent dry etching, on a non-etched surface portion of said substrate after said first dry etching; and 
 (d) next dry etching said substrate having said thin film formed thereon, and wherein 
 the step (c) carried out such way that the particles of masking material forming said thin film are obliquely deposited on said substrate due to substrate inclination. 
 
     
     
       9. A method of forming a micro groove structure according to  claim 8 , wherein after the steps (a) to (d) are carried out successively, the steps (c) and (d) are repeated successively one or more times. 
     
     
       10. A method of forming a micro groove structure according to  claim 8 , wherein said mask pattern formed in the step (a) is a pattern of straight lines periodic in one direction or in two directions in a plane of said substrate. 
     
     
       11. A method of forming a micro groove structure according to  claim 8 , wherein said substrate has a multilayer film structure. 
     
     
       12. A method of forming a micro groove structure according to  claim 8 , wherein an angle of incidence of the particles of masking material to a surface of said substrate is substantially larger than an angle at which the particles of said masking material reach a portion of the substrate to be etched in the step (d). 
     
     
       13. A method of forming a micro groove structure, comprising the steps of:
 (a) forming a mask pattern on a substrate capable of being subjected to dry etching; 
 (b) first dry etching said substrate having said mask pattern formed thereon; 
 (c) vapor-phase forming a thin film by sputtering particles of a masking material for subsequent dry etching, on a non-etched surface portion of said substrate after said first dry etching; and 
 (d) next dry etching said substrate having said thin film formed thereon, and wherein 
 the step (c) carried out such way that the particles of masking material forming said thin film are deposited obliquely to the substrate due to a baffle being disposed in front of said substrate when particles of masking material forming said thin film are deposited on said substrate. 
 
     
     
       14. A method of forming a micro groove structure according to  claim 13 , wherein after the steps (a) to (d) are carried out successively, the steps (c) and (d) are repeated successively one or more times. 
     
     
       15. A method of forming a micro groove structure according to  claim 13 , wherein said mask pattern formed in the step (a) is a pattern of straight lines periodic in one direction or in two directions in a plane of said substrate. 
     
     
       16. A method of forming a micro groove structure according to  claim 13 , wherein said substrate has a multilayer film structure.