Polyimide based compositions useful as electronic substrates, derived in part from (micro-powder) fluoropolymer, and methods and compositions relating thereto

Abstract

The present invention is a polymeric composite comprising a polyimide component and a fluoropolymer component derived from a micro powder. The fluoropolymer micro powder has a melt point between 250 and 375° C. The fluoropolymer micro powder has an average particle size between 20 and 5000 nanometers (5.0 microns). The polyimide component and the fluoropolymer component are inter-mixed at a high dispersion level where the fluoropolymer component is present in a weight ratio from 10 to 60 percent. The polymeric composite of these two components is particularly useful in the form of a thin film used in high-speed digital circuitry or high signal integrity for low loss of a digital signal. The film can also be used as a wire wrap, or as a coverlay or base film substrate for flexible circuitry laminates.

1. A single layer substrate useful for electronic or electrical applications either alone or as a component of a multilayer structure, the single layer substrate comprising a polymeric blend of at least a polyimide component and a fluoropolymer component, wherein:
 a. the fluoropolymer component is present in a range between and including any two of the following: 9, 10, 15, 20, 25, 30, 25, 40, 45, 50, 55, 60, 65, 70, 75, 80, 90, 95, 100, 110 and 120 weight parts per 100 weight parts polyimide component, and 
 b. the fluoropolymer component;
 i. is derived from a fluoropolymer micro powder having an average particle size in a range between and including any two of the following: 5, 4, 3, 2, 1, 0.8, 0.6, 0.5, 0.4, 0.3, 0.2, 0.1, 0.08, 0.06, 0.04, or 0.02 microns; 
 ii. has a melting temperature less than or equal to 375, 370, 365, 350, 325, 300, 280, 275, 265 or 250° C.; 
 
 c. wherein the single layer substrate has an outer surface and an interior core, the outer surface comprising an amount of fluoropolymer component greater than the amount of fluoropolymer component present in the interior core; and the interior core comprising an amount of polyimide component greater than the amount of polyimide component present at the outer surface. 
 
     
     
       2. A single layer substrate in accordance with  claim 1 , wherein the single continuous phase defines a thickness of at least 0.05, 0.1, 0.2, 0.3, 0.4, 0.5, 1, 2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 15, 20, 25, 50 or 60 microns. 
     
     
       3. A single layer substrate in accordance with  claim 2 , having a water absorption value being in a range between and including any two of the following: 0.1, 0.2, 0.3, 0.4, 0.5, 0.6, 0.7, 0.8, 0.9, 1.0, 1.1, 1.2, 1,3, 1.4, 1.5, 1.6, 1.7, and 1.75. 
     
     
       4. A single layer substrate in accordance with  claim 3 , wherein the substrate is created in part by combining a polyimide precursor solution and the fluoropolymer micro powder and subjecting the combination to a shear and a temprature sufficient to reduce fluoropolymer micro powder agglomeration to an average of less than 5, 4, 3, 2.5, 2, 1, 0.5, 0.2, 0.1, 0.05, or 0.02 microns. 
     
     
       5. A single layer substrate in accordance with  claim 4 , wherein, the substrate is laminated to a metal. 
     
     
       6. A single layer substrate in accordance with  claim 5 , having a water absorption value between and including any two of the following numbers, 0.1, 0.2, 0.3, 0.4, 0.5, 0.6, 0.7, 0.8, 0.9, 1.0 1.1, 1.2, 1.3, 1.4, 1.5, 1.6, 1.7, and 1.75 percent, and a dissipation loss being in a range from 0.0005 to 0.0020 at 1 MHz. 
     
     
       7. A single layer substrate in accordance with  claim 1 , the substrate having a total thickness in a range between and including any two of the following: 10, 20, 30, 40, 50, 60, 70, 80, 90, 100, 110, 120, 130, 140, 150, 160, 170, 180, 190 and 200 microns. 
     
     
       8. A single layer substrate in accordance with  claim 7 , wherein at least 20, 30, 40, 50, or 60 weight percent of the substrate is a single continuous phase comprising either the polyimide component or the fluoropolymer component. 
     
     
       9. A single layer substrate in accordance with  claim 7 , wherein at least 40, 50, 60, 70 or 80 weight percent of the substrate is defined by a first phase and a second phase, both phases being discrete continuous phases, the first phase being a polyimide and the second phase being a fluoropolymer. 
     
     
       10. A single layer substrate in accordance with  claim 1 , wherein the polyimide component is derived from a polyamic acid precursor created at least in part by contacting one or more dianhydride components with one or more diamine components, the dianhydride component being selected from a group consisting of: pyromellitic dianhydride, 4,4′-oxydiphthalic anhydride, bis(3,4-dicarboxyphenyl)sulfone dianhydride, 2,2-bis(3,4-dicarboxyphenyl) 1,1,1,3,3,3,-hexafluoropropane dianhydride (6FDA), 2,2′-bis[4-(3,4-dicarboxyphenoxy)phenyl]propane dianhydride, 3,3′,4,4′-benzophenonetetracarboxylic dianhydride, 3,3′,4,4′-biphenyltetracarboxylic dianhydride, and combinations thereof. 
     
     
       11. A single layer substrate in accordance with  claim 1 , wherein the polyimide component is derived from a polyamic acid precursor created at least in part by contacting one or more dianhydride components with one or more diamine components, the diamine component being selected from a group consisting of: 1,4-diaminobenzene, 1,3-diaminobenzene, 4,4′-diaminodiphenyl ether (4,4′-ODA), 3,4′-diaminodiphenyl ether (3,4′-ODA), 1,3-bis-(4-aminophenoxy) benzene (APB-134), 1,3-bis-(3-aminophenoxy)benzene (APB-133), 2,2-bis-[4-(4-aminophenoxy)phenyl]propane (BAPP), bis-(4-(4-aminophenoxy)phenyl sulfone (BAPS), 4,4′-bis(3-aminophenoxy)diphenylsulfone (m-BAPS), 4,4′-bis-(aminophenoxy)biphenyl (BAPB), bis(4-[4-minophenoxy]phenyl)ether (BAPE), 2,2′-bis-(4-aminophenyl)-1,1,1,3,3-hexafluoro propane (6F diamine), and combinations thereof. 
     
     
       12. A single layer substrate in accordance with  claim 1 , wherein the fluoropolymer component is derived from a fluoropolymer component selected from the group comprising tetrafluroethylene perfluoroalkylvinylether copolymer (PFA), chlorotrifluoroethylene polymer (CTFE), tetrafluoroethylene chlorotrifluoroethylene copolymer (TFE/CTFE), ethylene chlorotrifluoroethytene copolymer (ECTFE), and polyvinylidene fluoride (PVDF), poly(tetrafluoroethylene-co-hexafluoropropylene) (FEP), polytetrafluoroethylene (PTFE), and poly(ethylene-co-tetrafluoroethylene) (ETFE). 
     
     
       13. A single layer substrate in accordance with  claim 1 , wherein the dielectric constant of the substrate is between and including any two of the following numbers: 2.0, 2.1, 2.2, 2.3, 2.4, 2.5, 2.6, 2.7, 2.8, 2.9, 3.00, 3.1, 3.2, 3.3, 3.4, and 3.5. 
     
     
       14. A single layer substrate in accordance with  claim 1 , said substrate comprising all or part of a high speed digital antenna. 
     
     
       15. A single layer substrate in accordance with  claim 1 , said substrate being a component of a microwave receiver, a microwave transmitter or a microwave transceiver. 
     
     
       16. A single layer substrate in accordance with  claim 1 , said substrate being a component of a multilayer flexible or rigid circuit board. 
     
     
       17. A single layer substrate in accordance with  claim 1 , said substrate being a component of a level one or level two circuit package. 
     
     
       18. A single layer substrate in accordance with  claim 1 , said substrate comprising all or part of a housing for one or more conductive wires or cables. 
     
     
       19. A single layer substrate in accordance with  claim 1 , further comprising a filler. 
     
     
       20. A single layer substrate in accordance with  claim 1 , further comprising a filler selected from a group consisting of a silicon gel, a silica, a carbon, a zeolite, an air-sol product, and a metal oxide. 
     
     
       21. A single layer substrate in accordance with  claim 1 , further comprising a filler selected from the group consisting of dicalcium phosphate, alumina, and titania. 
     
     
       22. A substrate in accordance with  claim 1 , wherein the substrate is a component of a packaging composition, the packaging composition being a chip on lead (“COL”) package, a chip on flex (“COF”) package, a lead on chip (“LOC”) package, a multi-chip module (“MCM”) package, optoelectronic package, flat-wire applications, a ball grid array (“BGA” or “μ-BGA”) package, chip scale package (“CSP”) or a tape automated bonding (“TAB”) package. 
     
     
       23. A substrate in accordance with  claim 1 , wherein the substrate is a component of a integrated circuit packaging substrate comprising a conductive passageway, said passageway comprising one or more members of the following group: a wire bond, a conductive metal, and a solder bump.