Organic semiconductor device, RF modulation circuit, and IC card

Abstract

A pair of electrodes are provided to sandwich an organic semiconductor layer. A lead-out electrode is provided to each of the organic semiconductor layer and the two electrodes constituting the pair of electrodes. Consequently, there is provided an organic semiconductor device having a simple configuration.

1. An organic semiconductor device comprising:
 a pair of electrodes opposite to each other on a substrate and an organic semiconductor layer between said pair of electrodes; 
 a first lead-out electrode connected to a first electrode of said pair of electrodes; 
 a second lead-out electrode connected to a second electrode of said pair of electrodes; and 
 a third lead-out electrode connected to said organic semiconductor layer, 
 wherein said first electrode, said organic semiconductor layer, and said second electrode are substantially layered on said substrate in the order of said first electrode, said organic semiconductor layer, and said second electrode, 
 wherein a surface for providing said organic semiconductor layer of said first electrode comprises a part for providing said organic semiconductor layer and an excess part where said organic semiconductor layer is not provided, and 
 wherein said excess part where said organic semiconductor layer is not provided surrounds said part for providing said organic semiconductor layer. 
 
   
   
     2. An organic semiconductor device comprising:
 a pair of electrodes opposite to each other on a substrate and an organic semiconductor layer between said pair of electrodes; 
 a first lead-out electrode connected to a first electrode of said pair of electrodes; 
 a second lead-out electrode connected to a second electrode of said pair of electrodes; and 
 a third lead-out electrode connected to said organic semiconductor layer, 
 wherein said first electrode, said organic semiconductor layer and said second electrode are substantially layered on said substrate in the order of said first electrode, said organic semiconductor layer, and said second electrode, 
 wherein a surface for providing said second electrode of said organic semiconductor layer comprises a part for providing said second electrode and an excess part where said second electrode is not provided, and 
 wherein said excess part where said second electrode is not provided surrounds the part for providing said second electrode. 
 
   
   
     3. An organic semiconductor device comprising:
 a first electrode disposed on a substrate; 
 an organic semiconductor layer disposed on said first electrode; and 
 a second electrode disposed on said organic semiconductor layer, 
 wherein said first electrode has an excess part where said organic semiconductor layer is not disposed, the excess part of said first electrode surrounding a part underneath said organic semiconductor layer, 
 wherein said organic semiconductor layer has an excess part where said second electrode is not disposed, the excess part of said organic semiconductor layer surrounding a part underneath said second electrode, and 
 wherein a third electrode is disposed on a surface of the excess part of said organic semiconductor layer.