Package for electronic component and method of manufacturing piezoelectric device

Abstract

Aspects of the invention provide a package for accommodating a piezoelectric resonator that can include more mounting electrodes than connecting electrodes of the piezoelectric resonator element. The mounting electrodes can be electrically connected with a wiring pattern. In the lower surface of a package body, there can be formed external terminals at the four corners thereof. The external terminals are bonded to a mounting board. The external terminals are electrically connected to the mounting electrodes, respectively. The external terminal is not connected electrically to either of the mounting electrodes. Therefore, positions of the external terminals for operating the piezoelectric resonator can be changed based on whether a pair of connecting electrodes of the piezoelectric vibration element is bonded to the mounting electrodes, or it is connected to the mounting electrodes. Accordingly, it can be possible to easily change positions of external terminals for connecting to a circuit on a board.

1. A package for an electronic component that accommodates a component body, comprising:
 a package body; 
 mounting electrodes, provided on respective one of both sides of an upper surface of the package body in a predetermined number greater than a number of connecting electrodes of the component body, to which the connecting electrodes are selectively bonded; 
 a plurality of external terminals formed on a lower surface of the package body and electrically coupled to the mounting electrodes, the external terminals bonding with a mounting board and being isolated from each other; and 
 a part of the external terminals being electrically coupled to more than one of the mounting electrodes. 
 
   
   
     2. A package for an electronic component that accommodates a component body provided with a pair of connecting electrodes, comprising:
 a package body having a base sheet at a bottom portion; 
 mounting electrodes each pair of which is provided on respective one of both sides of an upper surface of the base sheet, and is selected in accordance with rotation of the component body to be bonded with the pair of connecting electrodes that are selectively bonded to the component body; 
 three external terminals formed on a lower surface of the package body, electrically coupled to the pair of mounting electrodes of one side and one of the pair of mounting electrodes of the other side, and isolated from each other; and 
 the other of the pair of mounting electrodes of the other side being electrically coupled to either one of the pair of electrodes of the one side; 
 the external terminals being bonded with a mounting board. 
 
   
   
     3. A package for an electronic component that accommodates a component body provided with a pair of connecting electrodes, comprising:
 a package body; 
 mounting electrodes, each pair of which is provided on respective one of diagonals of a bottom surface of the package body, and is selected in accordance with rotation of the component body to be bonded with the pair of connecting electrodes that are selectively bonded to the component body; 
 three external terminals that are formed on a lower surface of the package body, electrically coupled to the pair of mounting electrodes of one side and one of the pair of mounting electrodes of the other side, and isolated from each other; and 
 the other of the pair of mounting electrodes of the other side being electrically coupled to either one of the pair of electrodes of the one side; 
 the external terminals being bonded with a mounting board. 
 
   
   
     4. A package for an electronic component that accommodates a component body, comprising:
 a package body having a base sheet at a bottom portion; 
 mounting electrodes, provided in a predetermined number greater than a number of connecting electrodes of the component body, to which the connecting electrodes are selectively bonded, the mounting electrodes being mounted on respective one of both sides of an upper surface of the base sheet; 
 a plurality of external terminals formed on a lower surface of the package body and electrically coupled to the mounting electrodes, the external terminals bonding with a mounting board and being isolated from each other; and 
 the plurality of external terminals being formed asymmetrically about any pivots. 
 
   
   
     5. The package for an electronic component according to  claim 1 ,
 at least a part of the plurality of mounting electrodes having a different area from an area of another of the mounting electrodes. 
 
   
   
     6. The package for an electronic component according to  claim 5 , further comprising:
 an extension pattern electrically coupled to at least one of the plurality of mounting electrodes. 
 
   
   
     7. A package for an electronic component that accommodates a component body, comprising:
 a package body having a base sheet at a bottom portion; 
 mounting electrodes, provided in a predetermined number greater than a number of connecting electrodes of a first component body, to which the connecting electrodes are selectively bonded, the mounting electrodes being mounted on respective one of both sides of an upper surface of the base sheet; 
 a plurality inner terminals electrically coupled to electrodes of a second component body; 
 a plurality of external terminals formed on a lower surface of the package body and electrically coupled to a part of the inner terminals, the external terminals bonding with a mounting board and being isolated from each other; and 
 each of the plurality of mounting electrodes being electrically coupled to corresponding one of the inner terminals. 
 
   
   
     8. The package for an electronic component according to  claim 7 , the package body comprising:
 a separator section; 
 the mounting electrodes being formed on one side of the separator section; and 
 the inner terminals being formed on the other side of the separator section. 
 
   
   
     9. A package for an electronic component that accommodates the component body, comprising:
 a package body having a base sheet at a bottom portion; 
 mounting electrodes, provided in a predetermined number greater than a number of connecting electrodes of a first component body, to which the connecting electrodes are selectively bonded the mounting electrodes being mounted on an upper surface of the base sheet; 
 a plurality external terminals, provided on a lower surface of the package body, that bond with a mounting board; 
 an upper terminal, provided on an upper surface of the package body, to which an electrode of a second component body disposed above the first component body is electrically coupled; 
 a part of the plurality of mounting electrodes being coupled to the external terminal while another part thereof being electrically coupled to an upper terminal; and 
 a part of the upper terminals being electrically coupled to corresponding one of the external terminals. 
 
   
   
     10. A package for an electronic component that accommodates a component body, comprising:
 a package body having a base sheet at a bottom portion; 
 a plurality of mounting electrodes, provided on respective one of both sides of an upper surface of the base sheet of the package body in a predetermined number greater than a number of connecting electrodes of the component body, and which is selected in accordance with rotation of the component body to be selectively bonded with connecting electrodes; and 
 a plurality of external terminals formed on a lower surface of a package body, electrically coupled to the mounting electrodes, for bonding with a mounting board, and being isolated from each other. 
 
   
   
     11. The package for an electronic component according to  claim 10 ,
 a part of the external terminals being electrically coupled to more than one of the mounting electrodes. 
 
   
   
     12. A method of manufacturing a piezoelectric device using a package for an electronic component according to  claim 1 , comprising:
 selecting the mounting electrodes in accordance with a required specification to bond the connecting electrodes of a piezoelectric vibrator element therewith.