Semiconductor light emitting device and method of making the same
Abstract
The invention provides a semiconductor light emitting device and the method of making it. The semiconductor light emitting device, according to the invention, includes an undoped In x GA y Al 2 N film, as an Ohmic layer, formed between a top-most semiconductor material layer and a transparent conductive oxide layer. Since the undoped film as a tunneling layer is very thin (≦20 angstroms), the electric field across the tunneling layer, under forward bias, will make electron tunneling from valence band to conduction band, and return to the transparent conductive layer, A reasonably low and stable forward voltage of the semiconductor light emitting device according to the invention can be achieved.
Claims
exact text as granted — not AI-modified1. A semiconductor light emitting device, comprising:
a semiconductor substrate;
a multi-layer structure formed on the semiconductor substrate, the multi-layer structure comprising a light emitting region;
an undoped film of In x Ga y Al z N overlaying the multi-layer structure, wherein x+y+z=1, and 0≦x,y,z≦1; and
a layer, consisting of a transparent conductive oxide, overlaying the undoped film;
wherein an operating forward voltage of said semiconductor light emitting device is determined by the following formula:
V
t
=
EXP
(
-
4
(
2
m
*
·
E
g
3
)
3
/
2
3
e
·
h
_
·
E
)
,
m * is the effective electron or hole mass, E g is the effective band-gap of the undoped film, e is an electron charge, {overscore (h)} is the Plank's constant, and E is the electric field across the undoped film.
2. The semiconductor light emitting device of claim 1 , wherein the undoped film is formed by an epitaxial process, and a thickness of the undoped film is less than or equal to 20 Angstroms.
3. The semiconductor light emitting device of claim 1 , wherein the operating forward voltage is less than or equal to 3.7 Volts.
4. The semiconductor light emitting device of claim 1 , wherein the transparent conductive oxide is one selected from the group consisting of ITO, ZnO, InO and ZrO.
5. The semiconductor light emitting device of claim 1 , wherein the light emitting region comprises one selected from the group consisting of a PN-junction, a double hetero-junction and a multiple quantum well.
6. The semiconductor light emitting device of claim 1 , wherein the multi-layer structure comprises a layer contacting the undoped film and formed from a matertal selected from the group consisting of GaN, AIGaN, InGaN and InGaAIN.Cited by (0)
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