Thin electronic label and method for making same

Abstract

The aim of this invention is to provide a thin flexible card or electronic label, wherein are mounted electronic components with a reliable electric connection between their contacts and card conductors. The card or electronic label is produced by assembling at least one thin, flexible substrate ( 7 ), a conductive layer ( 4 ), an adhesive layer ( 1 ), and at least one electronic component ( 11 ). The substrate ( 7 ) includes at least one window ( 8 ) wherein is housed the electronic component ( 11 ), the adhesive layer ( 1 ) maintains the conductive layer ( 8 ) on the substrate, the conductive layer ( 4 ) extends partially into the window's surface ( 8 ) so as to form at least one electric contact ( 4′ ) whereon the electronic component ( 11 ) is connected. The substrate ( 7 ) has a thickness preferably selected on the basis of the greatest height of the electronic component ( 11 ) to be mounted.

1. Method for manufacturing cards or electronic labels carried out by assembling at least one thin, flexible substrate, a conductive layer, an adhesive layer, and at least one electronic component, said conductive layer being made up of conductive tracks defining an antenna extending on a face of the substrate, comprising the steps of:
 cutting out of at least one segment into the conductive layer, 
 cutting out of at least one window into the adhesive layer, 
 cutting out, into the substrate, of at least one window intended to receive the electronic component, 
 superimposition and lamination of the adhesive and conductive layers on the substrate in order to make correspond the windows made previously into the adhesive layer and into the substrate, 
 realization, into the conductive layer, of an electric circuit made up of a plurality of tracks forming at least the antenna, and providing of at least one connection surface located in the window of the substrate for connecting the electronic component, 
 positioning of the electronic component into the window of the substrate and connecting said electronic component to the connection surface previously provided. 
 
   
   
     2. Method according to  claim 1 , wherein the adhesive layer is made up of an adhesive film. 
   
   
     3. Method according to  claim 1 , wherein the adhesive layer is applied by silk-screening on the conductive layer with protected areas for cuffing out the windows. 
   
   
     4. Method according to  claim 1 , wherein the adhesive layer is applied by silk-screening onto the substrate with protected areas for cuffing out the windows. 
   
   
     5. Method according to  claim 1 , wherein the realization of the electric circuit is carried out by stamping, machining or chemical etching of the conductive layer. 
   
   
     6. Method according to  claim 1 , wherein the connection of said electronic component is carried out by soldering, cold or hot conductive bonding on the conductive film, or thermo-compression. 
   
   
     7. Method according to  claim 1 , wherein the cuffing out of the windows in the adhesive layer, the substrate and the segment in the conductive layer is carried out by stamping. 
   
   
     8. Method according to  claim 1 , wherein the conductive layer is deposited so as to extend partially into the surface of the window of the substrate and forms at least two electronic contacts on which the electronic component is connected. 
   
   
     9. Method according to  claim 1 , wherein the conductive layer is deposited in such a way as to extend into the surface of the window of the substrate and forms at least one electric contact on which the electronic component is connected, another electric contact being formed by means of a bridge connecting a more distant connection area on the conductive layer. 
   
   
     10. Method according to any one of the  claims 1  to  9 , wherein the thickness of the substrate is at least equal to the height of the highest electronic component. 
   
   
     11. Method according to  claim 10 , wherein a final step consists in assembling a film of insulating material on each face of the assembly, said film serving as protection support allowing a marking to be made. 
   
   
     12. Method according to any one of the  claims 1  to  9 , wherein a final step consists in assembling a film of insulating material on each face of the assembly, said film serving as protection support allowing a marking to be made.