Waveguide coupler

Abstract

Conventionally, waveguide terminals formed in a plurality of dielectric substrates are joined together by mounting the dielectric substrates on carriers and fastening them to a waveguide adapter with screws. In the present invention, to reduce cost and improve machinability, a plurality of solders 7 are disposed around the waveguide terminal 2 b formed in one dielectric substrate 1 b , and the other dielectric substrate 1 a having the waveguide terminal 2 a is placed across the solders 7 to thereby connect the waveguide terminals by soldering.

1. A waveguide coupler for connecting between waveguide terminals arranged in a rectangular shape and formed in a glass epoxy substrate and a ceramic substrate arranged opposite to each other, wherein
 each of said substrates includes a contact region which conducts electricity to a grounded conductor of said waveguide terminal, one said contact region being arranged to surround said waveguide terminal at a position opposite to the other said contact region when both said waveguide terminals are connected together, 
 said substrates are joined together with a plurality of electrically conductive joint members arranged in an array shaped like a rectangle surrounding said waveguide terminal between said opposing contact regions, and 
 said waveguide terminal of said ceramic substrate is formed by through holes arranged in a rectangular shape facing said waveguide terminal inside the array of said electrically conductive joint members, 
 wherein said glass epoxy substrate is attached to a metallic member having a waveguide terminal to be connected to the waveguide terminal of said glass epoxy substrate on a surface opposite to an opposing surface of said glass epoxy substrate facing said ceramic substrate. 
 
   
   
     2. The waveguide coupler according to  claim 1 ,
 wherein a plurality of said electrically conductive joint members are arranged in plural arrays shaped like a ring around said waveguide terminal. 
 
   
   
     3. The waveguide coupler, according to  claim 1 ,
 wherein a plurality of said electrically conductive joint members are formed of ball-shaped, barrel-shaped, or cylindrical solder, and 
 said two substrates are joined together by soldering. 
 
   
   
     4. The waveguide coupler, according to  claim 1 , wherein
 a plurality of said electrically conductive joint members are formed of a ball-shaped, barrel-shaped, or cylindrical metal or metal-containing material, and 
 said two substrates are joined together by thermal compression bonding using said metal or metal-containing material. 
 
   
   
     5. A waveguide coupler for connecting between waveguide terminals arranged in a rectangular shape and formed in a class epoxy substrate and a ceramic substrate arranged opposite to each other, wherein
 each of said substrates includes a contact region which conducts electricity to a grounded conductor of said waveguide terminal, one said contact region being arranged to surround said waveguide terminal at a position opposite to the other said contact region when both said waveguide terminals are connected together, 
 said substrates are joined together with a plurality of electrically conductive joint members arranged in an array shaped like a rectangle surrounding said waveguide terminal between said opposing contact regions, and 
 said waveguide terminal of said ceramic substrate is formed by through holes arranged in a rectangular shape facing said waveguide terminal inside the array of said electrically conductive joint members, wherein 
 a plurality of said electrically conductive joint members are formed of a ball-shaped, barrel-shaped, or cylindrical metal or metal-containing material, and 
 said two substrates are joined together by thermal compression bonding using said metal or metal-containing material.