TO-can having a leadframe

Abstract

The present invention relates to a TO-can type encapsulating element for enclosing, either hermetically or non-hermetically, optical-electrical chips with integrated optical element interfaces, detachable fibres and leadframes. The TO-can/encapsulating element enables the optical fibre ( 9 ) to be readily positioned relative to the chip ( 25 ) with the aid of a fix-able can-flange ( 7 ), and eliminates the risk of crack formation by virtue of the component leads of said TO-can having been provided with and connected to a leadframe ( 6 ).

1. A TO-can type encapsulating element enclosing at least one optical-electrical chip comprising an integrated optical-element interface, detachable fibre pigtail and leadframe, wherein:
 a.) leads are connected to said leadframe, of which different legs are provided to be formed after separation by cutting locations on the leadframe, wherein the leads of the leadframe are length adapted or impedance matched for optimal transmission properties; 
 b.) the can is provided with a recess for inserting a ferrule-part with at least one optical-fibre to an inner space of the can; 
 c.) means for positioning the optical-fibre are provided to regulate the installation of the optical fibre in the recess towards an opto-electrical component disposed within said inner space of said can, whereby optimisation of in-going light from the optical-fibre to the chip, or out-going light from the chip to the optical-fibre, is possible. 
 
   
   
     2. The TO-can type encapsulating element according to  claim 1 , wherein an optical contact element is attached to or released from the can with the aid of mutually opposing ferrule interfaces.