Sealing material tablet method of manufacturing the tablet and electronic component device

Abstract

To provide a method of producing an encapsulating molding material tablet by which adhesion of an encapsulating molding material to the punch surface of a tablet forming machine can be reduced, an encapsulating molding material tablet produced by this method, and an electronic part apparatus equipped with an element encapsulated using this encapsulating molding material tablet. A method of producing an encapsulating molding material tablet in which a release agent dissolved in a solvent is fed to the punch surface of a tablet forming machine to form a release agent layer having a thickness of over 0.001 μm and less than 0.07 μm on the above-mentioned punch surface, then, an encapsulating molding material is fed to the above-mentioned tablet forming machine for molding the material, an encapsulating molding material tablet produced by this method or having a contact angle ratio of 1.15 or more and less than 1.35, and an electron part apparatus equipped with an element encapsulated using this encapsulating molding material tablet.

1. A method of producing an encapsulating molding material tablet comprising:
 feeding an encapsulating molding material to a forming metal die, and 
 compressing the encapsulating molding material by upper and lower punches of the forming metal die, 
 wherein a contact surface of at least one of the upper and lower punches, being the surface thereof closest to the encapsulating molding material, has thereon a release agent layer having a thickness greater than 0.001 μm and less than 0.07 μm. 
 
     
     
       2. The method of producing an encapsulating molding material tablet according to  claim 1 , wherein the release agent contains at least one of fluorine-based release agents and silicone-based release agents. 
     
     
       3. The method of producing an encapsulating molding material tablet according to  claim 2 , wherein the fluorine-based release agent is at least one of perfluoroalkyl-containing polymers and polytetrafluoroethylene. 
     
     
       4. The method of producing an encapsulating molding material tablet according to  claim 2 , wherein the silicone-based release agent is carboxyl group-modified dimethylpolysiloxane. 
     
     
       5. The method of producing an encapsulating molding material tablet according to  claim 2 , wherein a release agent dissolved in a solvent is fed to the contact surface, of the at least one of the upper and lower punches, with the encapsulating molding material, to provide a release agent layer. 
     
     
       6. The method of producing an encapsulating molding material tablet according to  claim 5 , wherein the solvent has no flammability. 
     
     
       7. An encapsulating molding material tablet produced by the production method according to  claim 5 . 
     
     
       8. An encapsulating molding material tablet produced by the production method according to  claim 2 . 
     
     
       9. The method of producing an encapsulating molding material tablet according to  claim 1 , wherein a release agent dissolved in a solvent is fed to the contact surface, of the at least one of the upper and lower punches, with the encapsulating molding material, to provide a release agent layer. 
     
     
       10. The method of producing an encapsulating molding material tablet according to  claim 9 , wherein the solvent has no flammability. 
     
     
       11. An encapsulating molding material tablet produced by the production method according to  claim 9 . 
     
     
       12. The method of producing an encapsulating molding material tablet according to  claim 9 , wherein a solution of the release agent on the solvent includes 0.01 to 10 wt % of the release agent, based on the solvent. 
     
     
       13. The method of producing an encapsulating molding material tablet according to  claim 12 , wherein a solution includes 0.1 to 3 wt % of the release agent, based on the solvent. 
     
     
       14. An encapsulating molding material tablet produced by the production method according to  claim 1 . 
     
     
       15. An electronic part apparatus equipped with an element encapsulated using the encapsulating molding material tablet according to  claim 14 . 
     
     
       16. The encapsulating molding material tablet according to  claim 14 , wherein the contact angle ratio is greater than 1.15 and less than 1.35. 
     
     
       17. The encapsulating molding material tablet according to  claim 14 , comprising: (A) a thermosetting resin, (B) a hardener and (C) an inorganic filler. 
     
     
       18. The method of producing an encapsulating molding material tablet according to  claim 1 , wherein the encapsulating molding material tablet has a contact angle ratio of greater than 1.15 and less than 1.35. 
     
     
       19. The method of producing an encapsulating molding material tablet according to  claim 1 , including the further step of forming the release agent layer on said contact surface. 
     
     
       20. The method of producing an encapsulating molding material tablet according to  claim 19 , wherein the release agent layer is formed by painting or by spray coating. 
     
     
       21. The method of producing an encapsulating molding material tablet according to  claim 19 , wherein said release agent layer is formed intermittently, and tablets are formed continuously by the forming metal die. 
     
     
       22. The method of producing an encapsulating molding material tablet according to  claim 19 , wherein said thickness of said release agent layer is from 0.01 to 0.02 μm. 
     
     
       23. An encapsulating molding thermosetting resin material tablet having a contact angle ratio of at least 1.15 and less than 1.35. 
     
     
       24. The encapsulating molding thermosetting resin material tablet according to  claim 23 , comprising: (A) a thermosetting resin, (B) a hardener and (C) an inorganic filler. 
     
     
       25. An electronic part apparatus equipped with an element encapsulated using the encapsulating molding thermosetting resin material tablet according to  claim 23 . 
     
     
       26. The encapsulating molding thermosetting resin material tablet according to  claim 23 , wherein said contact angle ratio is 1.18 or more and less than 1.28. 
     
     
       27. The encapsulating molding thermosetting resin material tablet according to  claim 23 , wherein said contact angle ratio is 1.20 or more and less than 1.25.