Method for encapsulating a plurality of electronic components

Abstract

A method for encapsulating the electronic component and a method for producing electronic components according to the method include coating the component with a coating material. The coating material is hardened and an assembly including the component and the coating is encapsulated in plastic. In particular, the coating can be accomplished by immersion. The electronic component includes the coating encapsulation of a coating material applied in a flowable condition and hardened and a plastic encapsulation encapsulating the coating.

1. A method for encapsulating a plurality of electronic components, which comprises:
 joining a plurality of components together; 
 coating the plurality of components at the same time for providing the plurality of components with a coating of a flowable coating material; 
 hardening the material of the coating; 
 subjecting the assembly including the plurality of components and the coating to at least one further process operation, the at least one further process operation being a welding of the plurality of components to a conductor comb; and 
 subsequent to the welding of the plurality of components to a conductor comb, completely encapsulating the assembly of the plurality of components and the coating in plastic. 
 
   
   
     2. The method according to  claim 1 , which further comprises applying the coating material to the plurality of components by immersion. 
   
   
     3. The method according to  claim 1 , which further comprises carrying out the coating providing step by immersing the plurality of components in the coating material. 
   
   
     4. The method according to  claim 1 , which further comprises applying the coating material to the plurality of components by spraying. 
   
   
     5. The method according to  claim 1 , which further comprises carrying out the coating providing step by spraying the coating material on the plurality of components. 
   
   
     6. The method according to  claim 1 , which further comprises carrying out the coating providing step by applying the coating material to the plurality of components by several successive coating operations. 
   
   
     7. The method according to  claim 1 , which further comprises carrying out the hardening step by supplying external heat. 
   
   
     8. The method according to  claim 1 , which further comprises carrying out the hardening step by heating the coating. 
   
   
     9. The method according to  claim 1 , which further comprises carrying out the hardening step by drying under environmental conditions. 
   
   
     10. The method according to  claim 1 , which further comprises providing coating material of the coating with a high coefficient of expansion and good adhesion properties. 
   
   
     11. The method according to  claim 1 , which further comprises selecting the coating material from a plastic selected from the group consisting of polyurethane and silicone. 
   
   
     12. The method according to  claim 1 , which further comprises carrying out the plastic encapsulating step by injection molding the assembly with PBT. 
   
   
     13. The method according to  claim 1 , which further comprises carrying out the plastic encapsulating step by encapsulating the assembly by injection molding PET. 
   
   
     14. The method according to  claim 1 , wherein the completely encapsulating step is achieved by injection molding. 
   
   
     15. The method according to  claim 10 , which further comprises selecting the coating material from a plastic selected from the group consisting of polyurethane and silicone. 
   
   
     16. The method according to  claim 14 , further comprising separating the plurality of components by separating the conductor comb and encapsulating the separated components with a further encapsulation by injection molding.