US7246954B2ExpiredUtilityA1
Opto-electronic housing and optical assembly
Assignee: AVAGO TECH FIBER IP SG PTE LTDPriority: Aug 9, 2004Filed: Aug 9, 2004Granted: Jul 24, 2007
Est. expiryAug 9, 2024(expired)· nominal 20-yr term from priority
G02B 6/4257H01S 5/02251H01S 5/02208G02B 6/4269G02B 6/4201G02B 6/4256
56
PatentIndex Score
5
Cited by
30
References
14
Claims
Abstract
An opto-electronic housing and an opto-electronic assembly. The housing includes an enclosure defining a cavity. An opening through a wall of the enclosure is adapted to receive a substrate. A mount projects into the cavity opposite the opening. The mount is adapted to support an opto-electronic device. Adjacent the mount is an optically transmissive region in a wall of the enclosure. An opto-electronic assembly also includes a substrate disposed in the opening and an opto-electronic device supported by the mount.
Claims
exact text as granted — not AI-modifiedWe claim:
1. An opto-electronic housing comprising:
an enclosure defining a cavity and an exterior;
an opening through a wall of the enclosure and adapted to receive a substrate from the exterior for providing an electrical interface with an opto-electronic device in the cavity;
a mount projecting into the cavity opposite the first opening and adapted to support an opto-electronic device, wherein the mount projects into the cavity through a second opening in a wall of the enclosure; and
an optically transmissive region in a wall of the enclosure adjacent the mount, the optically transmissive region for communicating light between the opto-electronic device and the exterior.
2. An opto-electronic housing as in claim 1 wherein the mount is integrally formed with a wall of the enclosure.
3. An opto-electronic housing as in claim 1 and further comprising a heat sink in thermal communication with the mount and disposed outside the enclosure.
4. An opto-electronic housing as in claim 3 wherein the heat sink comprises a heat-dissipating plate.
5. An opto-electronic housing as in claim 4 wherein the heat-dissipating plate is substantially planar with an outside surface of the enclosure.
6. An opto-electronic housing as in claim 1 wherein the optically transmissive region comprises an opening.
7. An opto-electronic housing as in claim 1 wherein the optically transmissive region comprises a lens.
8. An opto-electronic housing as in claim 1 and further comprising a receptacle connected to the enclosure over the optically transmissive region and adapted to receive an optical fiber ferrule.
9. An opto-electronic assembly as in claim 1 wherein the enclosure comprises a plurality of walls and a sealant that seals a gap between adjacent ones of the walls.
10. An opto-electronic assembly comprising:
an opto-electronic housing as in claim 1 ;
a substrate carrying a plurality of electrical conductors, the substrate disposed in the opening and extending into the cavity; and
an opto-electronic device supported by the mount and in electrical communication with the electrical conductors.
11. An opto-electronic assembly as in claim 10 wherein an extremity of the substrate is notched to straddle the mount.
12. An opto-electronic assembly as in claim 10 wherein an extremity of the substrate defines an opening to receive the mount.
13. An opto-electronic assembly as in claim 10 and further comprising a rail on an interior surface of the cavity defining a channel to receive the substrate.
14. An opto-electronic assembly as in claim 10 and further comprising a sealant that seals a gap between the substrate and the first opening.Cited by (0)
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