US7246954B2ExpiredUtilityA1

Opto-electronic housing and optical assembly

56
Assignee: AVAGO TECH FIBER IP SG PTE LTDPriority: Aug 9, 2004Filed: Aug 9, 2004Granted: Jul 24, 2007
Est. expiryAug 9, 2024(expired)· nominal 20-yr term from priority
G02B 6/4257H01S 5/02251H01S 5/02208G02B 6/4269G02B 6/4201G02B 6/4256
56
PatentIndex Score
5
Cited by
30
References
14
Claims

Abstract

An opto-electronic housing and an opto-electronic assembly. The housing includes an enclosure defining a cavity. An opening through a wall of the enclosure is adapted to receive a substrate. A mount projects into the cavity opposite the opening. The mount is adapted to support an opto-electronic device. Adjacent the mount is an optically transmissive region in a wall of the enclosure. An opto-electronic assembly also includes a substrate disposed in the opening and an opto-electronic device supported by the mount.

Claims

exact text as granted — not AI-modified
We claim: 
     
       1. An opto-electronic housing comprising:
 an enclosure defining a cavity and an exterior; 
 an opening through a wall of the enclosure and adapted to receive a substrate from the exterior for providing an electrical interface with an opto-electronic device in the cavity; 
 a mount projecting into the cavity opposite the first opening and adapted to support an opto-electronic device, wherein the mount projects into the cavity through a second opening in a wall of the enclosure; and 
 an optically transmissive region in a wall of the enclosure adjacent the mount, the optically transmissive region for communicating light between the opto-electronic device and the exterior. 
 
     
     
       2. An opto-electronic housing as in  claim 1  wherein the mount is integrally formed with a wall of the enclosure. 
     
     
       3. An opto-electronic housing as in  claim 1  and further comprising a heat sink in thermal communication with the mount and disposed outside the enclosure. 
     
     
       4. An opto-electronic housing as in  claim 3  wherein the heat sink comprises a heat-dissipating plate. 
     
     
       5. An opto-electronic housing as in  claim 4  wherein the heat-dissipating plate is substantially planar with an outside surface of the enclosure. 
     
     
       6. An opto-electronic housing as in  claim 1  wherein the optically transmissive region comprises an opening. 
     
     
       7. An opto-electronic housing as in  claim 1  wherein the optically transmissive region comprises a lens. 
     
     
       8. An opto-electronic housing as in  claim 1  and further comprising a receptacle connected to the enclosure over the optically transmissive region and adapted to receive an optical fiber ferrule. 
     
     
       9. An opto-electronic assembly as in  claim 1  wherein the enclosure comprises a plurality of walls and a sealant that seals a gap between adjacent ones of the walls. 
     
     
       10. An opto-electronic assembly comprising:
 an opto-electronic housing as in  claim 1 ; 
 a substrate carrying a plurality of electrical conductors, the substrate disposed in the opening and extending into the cavity; and 
 an opto-electronic device supported by the mount and in electrical communication with the electrical conductors. 
 
     
     
       11. An opto-electronic assembly as in  claim 10  wherein an extremity of the substrate is notched to straddle the mount. 
     
     
       12. An opto-electronic assembly as in  claim 10  wherein an extremity of the substrate defines an opening to receive the mount. 
     
     
       13. An opto-electronic assembly as in  claim 10  and further comprising a rail on an interior surface of the cavity defining a channel to receive the substrate. 
     
     
       14. An opto-electronic assembly as in  claim 10  and further comprising a sealant that seals a gap between the substrate and the first opening.

Cited by (0)

No later patents cite this yet.

References (0)

No backward citations on record.