Cooling system for densely packed electronic components

Abstract

A more efficient cooling system for densely packed electronic components for use in an out-of-doors equipment enclosure. An array of cooling assemblies are placed on heat generating components mounted to printed circuit boards mounted in enclosure racks. Each board has a manifold for intake and exhaust of refrigerant, and larger rack manifolds are substituted for rails and are attached to a backplane. A hybrid package including a ceramic hybrid power module and an attached array of cooling assemblies provide even more density of components and improved cooling.

1. A cooling system for electronic equipment enclosures with densely packed components comprising:
 an electronic equipment enclosure; a rack mounted within said enclosure; 
 a plurality of boards mounted to said rack, at least one of said boards having a plurality of heat generating components mounted thereon; 
 a plurality of microscale cooling assemblies each one of said cooling assemblies being connected to one of said plurality of heat generating components, each cooling assembly including a heat insulative housing, an inlet port formed in said housing for receiving a heat transferring fluid, an outlet port formed in said housing for passing said heat transferring fluid, a thermally conductive element connected to said housing, an evaporator chamber formed by said housing and said thermally conductive element upstream of said outlet port and a capillary passage formed in said housing between said inlet port and said evaporator chamber; 
 a first intake manifold mounted to said rack; 
 a first exhaust manifold mounted to said rack; 
 a second intake manifold mounted to said board and to said first intake manifold; 
 a second exhaust manifold mounted to said board and to said first exhaust manifold; 
 a first fluid conduit connecting said board mounted second intake manifold and each of said plurality of cooling assemblies; 
 a second fluid conduit connecting said board mounted second exhaust manifold and each of said plurality of cooling assemblies; 
 a compressor; 
 a third fluid conduit connecting said rack mounted first intake manifold and said compressor; and 
 a fourth fluid conduit connecting said rack mounted first exhaust manifold and said compressor. 
 
   
   
     2. The system of  claim 1  wherein:
 said rack includes a rail; and 
 said plurality of boards are mounted to said rail. 
 
   
   
     3. The system of  claim 1  including:
 a backplane connected to said rack; and wherein 
 said plurality of boards are mounted to said backplane. 
 
   
   
     4. The system of  claim 1  including:
 a backplane connected to said rack; and 
 said first intake manifold and said first exhaust manifold are connected to said backplane. 
 
   
   
     5. The system of  claim 1  including:
 a backplane connected to said rack; and wherein 
 said rack includes a rail; 
 said first intake manifold and said first exhaust manifold are connected to said backplane; and 
 said plurality of boards are mounted to said rail and to said backplane.