Substrate having microstrip line structure, semiconductor device having microstrip line structure, and manufacturing method of substrate having microstrip line structure

Abstract

A substrate having a microstrip line structure is provided comprising a trench provided at least in one main surface of a base body constituting the substrate having an inner surface geometry of an unbent curved surface and corresponding to the pattern of the microstrip line; a laminate film having a ground conductive layer and an insulating layer formed along the inner surface geometry of the trench; and a signal line layer constituting the microstrip line formed on the laminate film; where the signal line layer has a configuration separated for each trench.

1. A substrate having a microstrip line structure, comprising:
 a plurality of longitudinally-extending trenches formed into at least one main surface of a base body constituting said substrate and disposed in a juxtaposed manner relative to each other as viewed in cross-section, each one of the plurality of trenches having an arcuate inner surface geometry as viewed in cross-section; 
 a laminate film having a ground conductive layer and an insulating layer formed along and entirely covering the inner surface geometry of each one of said plurality of trenches; and 
 a plurality of rectilinearly-extending signal line layers, each one of the plurality of signal line layers constituting said microstrip line formed into a respective one of said laminate films; 
 wherein respective ones of said signal line layers are separated from one another by adjacent, contiguous ones of the laminate films, 
 wherein said base body is an insulator, and 
 wherein said base body is formed integrally with a semiconductor. 
 
   
   
     2. A substrate having a microstrip line structure, comprising:
 a plurality of longitudinally-extending trenches formed into at least one main surface of a base body constituting said substrate and disposed in a juxtaposed manner relative to each other as viewed in cross-section, each one of the plurality of trenches having an arcuate inner surface geometry as viewed in cross-section; 
 a laminate film having a ground conductive layer and an insulating layer formed along and entirely covering the inner surface geometry of each one of said plurality of trenches; and 
 a plurality of rectilinearly-extending signal line layers each one of the plurality of signal line layers constituting said microstrip line formed into a respective one of said laminate films; 
 wherein respective ones of said signal line layers are separated from one another by adjacent, contiguous ones of the laminate films, and 
 wherein said laminate film is formed with a plurality of insulating layers. 
 
   
   
     3. A semiconductor device having a microstrip line structure, comprising:
 a plurality of longitudinally-extending trenches formed into at least one main surface of a base body constituting said substrate and disposed in a juxtaposed manner relative to each other as viewed in cross-section, each one of the plurality of trenches having an arcuate inner surface geometry as viewed in cross-section; 
 a laminate film having a ground conductive layer and an insulating layer formed along and entirely covering the inner surface geometry of each one of said plurality of trenches; and 
 a plurality of rectilinearly-extending signal line layers, each one of the plurality of signal line layers constituting said microstrip line formed into a respective one said laminate films; 
 wherein respective ones of said signal line layer layers are separated from one another by adjacent, contiguous ones of the laminate films, 
 a bump is formed on said microstrip line, and 
 a semiconductor chip is mounted on said bump, 
 wherein said base body is an insulator, and 
 wherein said base body is formed integrally with a semiconductor. 
 
   
   
     4. A semiconductor device having a microstrip line structure, comprising:
 a plurality of longitudinally-extending trenches formed into at least one main surface of a base body constituting said substrate and disposed in a juxtaposed manner relative to each other as viewed in cross-section, each one of the plurality of trenches having an arcuate inner surface geometry as viewed in cross-section; 
 a laminate film having a ground conductive layer and an insulating layer formed along and entirely covering the inner surface geometry of each one of said plurality of trenches; and 
 a plurality of rectilinearly-extending signal line layers, each one of the plurality of signal line layers constituting said microstrip line formed into a respective one said laminate films; 
 wherein respective ones of said signal line layer layers are separated from one another by adjacent, contiguous ones of the laminate films, 
 a bump is formed on said microstrip line, and 
 a semiconductor chip is mounted on said bump, and 
 wherein said laminate film is formed with a plurality of insulating layers. 
 
   
   
     5. A semiconductor device having a microstrip line structure comprising:
 a plurality of longitudinally-extending trenches formed into at least one main surface of a base body constituting said substrate and disposed in a juxtaposed manner relative to each other as viewed in cross-section, each one of the plurality of trenches having an arcuate inner surface geometry as viewed in cross-section; 
 a laminate film having a ground conductive layer and an insulating layer formed along and entirely covering the inner surface geometry of each one of said plurality of trenches; and 
 a plurality of rectilinearly-extending signal line layers, each one of the plurality of signal line layers constituting said microstrip line formed into a respective one said laminate films; 
 wherein respective ones of said signal line layer layers are separated from one another by adjacent, contiguous ones of the laminate films, 
 a bump is formed on said microstrip line, and 
 a semiconductor chip is mounted on said bump, and 
 wherein said semiconductor device is composed of a main board substrate and an interposer substrate, and the said base body is a base body constituting at least one of either of said main board substrate or said interposer substrate. 
 
   
   
     6. A method for manufacturing a substrate having a microstrip line, said method comprising the steps of:
 a trench forming step of forming, at least in one main surface of a base body constituting said substrate, a plurality of longitudinally-extending trenches disposed in a juxtaposed manner relative to each other as viewed in cross-section, each one of the plurality of trenches having an arcuate inner surface geometry as viewed in cross-section; 
 a laminate forming step of forming a laminate film having a ground conductive layer and an insulating layer along the inner surface geometry of each one of said plurality of trenches; 
 a step of forming a signal line layer on said laminate film of each one of the plurality of trenches; 
 a step of forming a bump on said microstrip line; and 
 a step of mounting a semiconductor chip on said bump, 
 wherein respective ones of said signal line layers are separated from one another by adjacent, contiguous ones of the laminate films, 
 wherein said base body is an insulator, and 
 wherein said base body is formed integrally with a semiconductor. 
 
   
   
     7. A method for manufacturing a substrate having a microstrip line, said method comprising the steps of:
 a trench forming step of forming, at least in one main surface of a base body constituting said substrate, a plurality of longitudinally-extending trenches disposed in a juxtaposed manner relative to each other as viewed in cross-section, each one of the plurality of trenches having an arcuate inner surface geometry as viewed in cross-section; 
 a laminate forming step of forming a laminate film having a ground conductive layer and an insulating layer along the inner surface geometry of each one of said plurality of trenches; 
 a step of forming a signal line layer on said laminate film of each one of the plurality of trenches; 
 a step of forming a bump on said microstrip line; and 
 a step of mounting a semiconductor chip on said bump, 
 wherein respective ones of said signal line layers are separated from one another by adjacent, contiguous ones of the laminate films, and 
 wherein said laminate film is formed with a plurality of insulating layers.