US7271114B2ExpiredUtilityPatentIndex 84
Perovskite ceramic powder and electronic component using same and manufacturing methods thereof
Est. expiryMar 24, 2023(expired)· nominal 20-yr term from priority
H01R 12/71C01P 2006/12C01P 2004/62H01R 13/46C01P 2002/34H01G 4/1209Y10T428/24926C04B 35/47C04B 2235/79B82Y 30/00C01P 2006/40C04B 2235/761H01G 4/30C01G 23/006C04B 2235/5454C04B 2235/6025C04B 2235/5445C04B 2235/5481Y10T428/24917H01G 4/1227C04B 35/4682C01P 2002/77C04B 2235/449C01G 1/02C04B 2235/441C04B 2235/444H01R 13/639C04B 2235/5409C01P 2002/72
84
PatentIndex Score
11
Cited by
1
References
7
Claims
Abstract
A ceramic powder having a perovskite structure is manufactured by synthesizing a ceramic powder by a dry synthesis process and then heat-treating the synthesized ceramic powder in a solution. The dry synthesis method includes a solid phase synthesis method, an oxalate method, a citric acid method and a gas phase synthesis method.
Claims
exact text as granted — not AI-modified1. Ceramic powder having a perovskite structure, which is obtained by a manufacturing method comprising synthesizing ceramic powder by non-wet synthesis method and heat-treating the synthesized ceramic powder in a solution,
wherein the ceramic powder has a crystal lattice of a tetragonal system; particles of the ceramic powder are equal to or less than 0.2 μm; a c/a axial ratio of the crystal lattice is equal to or greater than 1.006; and a ratio of area occupied by holes in a single particle of the ceramic powder is equal to or less than 5%, and
wherein a particle diameter distribution of the ceramic powder is less than 30%, the particle diameter distribution being standard deviation/mean diameter of particles.
2. Ceramic powder having a perovskite structure, which is obtained by a manufacturing method comprising synthesizing ceramic powder by a non-wet synthesis method and heat-treating the synthesized ceramic powder in a solution,
wherein the ceramic powder has a crystal lattice of a cubic system; particles of the ceramic powder is equal to or less than 0.2 μm; a full-width at half-maximum (FWHM) of an X-ray diffraction (XRD) (111) peak of the crystal lattice is equal to or smaller than 0.270°; and a ratio of area occupied by holes in a single particle of the ceramic powder is equal to or less than 5%, and
wherein a particle diameter distribution of the ceramic powder s less than 30%, the particle diameter distribution being standard deviation/mean diameter of particles.
3. Ceramic powder having a perovskite structure, wherein the ceramic powder has a crystal lattice of a tetragonal system; particles of the ceramic powder are equal to or less than 0.2 μm; a c/a axial ratio of the crystal lattice is equal to or greater than 1.006; and a ratio of area occupied by holes in a single particle of the ceramic powder is equal to or less than 5%, and
wherein a particle diameter distribution of the ceramic powder is less than 30%, the particle diameter distribution being standard deviation/mean diameter of particles.
4. Ceramic powder having a perovskite structure, wherein the ceramic powder has a crystal lattice of a cubic system; particles of the ceramic powder is equal to or less than 0.2 μm; a full-width at half-maximum (FWHM) of an X-ray diffraction (XRD) (111) peak of the crystal lattice is equal to or smaller than 0.270°; and a ratio of area occupied by holes in a single particle of the ceramic powder is equal to or less than 5%, and
wherein a particle diameter distribution of the ceramic powder is less than 30%, the particle diameter distribution being standard deviation/mean diameter of particles.
5. Ceramic electronic component comprising a dielectric portion made of the ceramic powder of claim 3 or 4 .
6. A method for manufacturing a ceramic electronic component comprising the step of forming a dielectric portion by employing the ceramic powder of claim 3 or 4 .
7. A multi-layer ceramic capacitor comprising:
a dielectric portion made of the ceramic powder of claim 3 or 4 ;
a plurality of internal electrodes whose edges are alternately exposed at two surfaces of the dielectric portion; and
a pair of external electrodes formed at surfaces of the dielectric portion to be connected to the exposed edges of the internal electrodes.Cited by (0)
No later patents cite this yet.
References (0)
No backward citations on record.