US7277068B2ExpiredUtilityPatentIndex 51
Electrode structure, fabrication method thereof and PDP utilizing the same
Est. expiryApr 12, 2024(expired)· nominal 20-yr term from priority
H01J 11/46H01J 9/02H01J 11/24H01J 11/12
51
PatentIndex Score
0
Cited by
5
References
7
Claims
Abstract
An electrode structure for a front board of a plasma display panel (PDP). The electronic structure connects all the sustain electrodes on the front board to prevent data transformation errors caused by holes. The fabrication method of the electronic structure is also disclosed.
Claims
exact text as granted — not AI-modified1. An electrode fabrication method comprising:
providing a substrate with a first region and a second region;
forming a first conductive material layer overlying the first region;
forming a second conductive material layer overlying the first region and the second region; and
patterning the second conductive material layer and the underlying first conductive material layer to form an electrode pattern, wherein the electrode pattern comprises a first electrode line, a second electrode line, and a connection segment, the first electrode line and the second electrode line are disposed in parallel and formed on the first region and the second region, and the connection segment connects the first electrode line and the second electrode line in the first region;
wherein the first region comprises a display region and a buffer region between the display and the second region.
2. The electrode fabrication method as claimed in claim 1 , wherein the connection segment is formed on the buffer region.
3. The electrode fabrication method as claimed in claim 1 , wherein the first electrode line and the second electrode line have a laminated construction with first conductive material layer and second conductive material layer.
4. The electrode fabrication method as claimed in claim 1 , wherein the connection segment forms on a portion of the buffer region.
5. The electrode fabrication method as claimed in claim 4 , wherein the connection segment further forms on a portion of the second region.
6. The electrode fabrication method as claimed in claim 1 , wherein the connection segment forms on the entire buffer region.
7. The electrode fabrication method as claimed in claim 6 , wherein the connection segment further forms on a portion of the second region.Cited by (0)
No later patents cite this yet.
References (0)
No backward citations on record.