US7282378B2ExpiredUtilityA1

Method of manufacturing inspection unit

86
Assignee: YOKOWO SEISAKUSHO KKPriority: Oct 28, 2004Filed: Oct 27, 2005Granted: Oct 16, 2007
Est. expiryOct 28, 2024(expired)· nominal 20-yr term from priority
Inventors:Takuto Yoshida
G01R 1/0466G01R 1/067G01R 1/045
86
PatentIndex Score
16
Cited by
21
References
6
Claims

Abstract

A conductive member having a first face adapted to be mounted on a board on which an inspection circuit is arranged, and a second face adapted to be opposed to a device to be inspected is prepared. The conductive member is formed with a first through hole having a first diameter and communicating the first face with the second face. A contact probe including a tubular body having a second diameter which is smaller than the first diameter, and a plunger retractably projected from one end portion of the tubular body is prepared and disposed in the first through hole. A conductive plate having a second through hole is prepared. Molten resin is injected into the second through hole such that at least a part of inner face of the second through hole is covered with solidified resin, thereby forming a third through hole. The conductive plate is disposed so as to oppose to the second face of the conductive member and to communicate the third through hole with the first through hole. The solidified resin is brought into contact with at least the one end portion of the tubular body so as to coaxially retain the contact probe in the first through hole while only the plunger is projected from the conductive plate.

Claims

exact text as granted — not AI-modified
1. A method of manufacturing an inspection unit, comprising:
 preparing a conductive member having a first face adapted to be mounted on a board on which an inspection circuit is arranged, and a second face adapted to be opposed to a device to be inspected, the conductive member being formed with a first through hole having a first diameter and communicating the first face with the second face; 
 preparing a contact probe comprising a tubular body having a second diameter which is smaller than the first diameter, and a plunger retractably projected from one end portion of the tubular body; 
 disposing the contact probe in the first through hole; 
 preparing a conductive plate having a second through hole; 
 injecting molten resin into the second through hole such that at least a part of inner face of the second through hole is covered with solidified resin, thereby forming a third through hole; and 
 disposing the conductive plate so as to oppose to the second face of the conductive member and to communicate the third through hole with the first through hole, wherein the solidified resin is brought into contact with at least the one end portion of the tubular body so as to coaxially retain the contact probe in the first through hole while only the plunger is projected from the conductive plate. 
 
   
   
     2. The manufacturing method as set forth in  claim 1 , wherein the retainer is formed by filling the second through hole with the molten resin, and drilling the third through hole in the solidified resin. 
   
   
     3. The manufacturing method as set forth in  claim 1 , wherein the retainer is formed by:
 preparing a mold having an identical shape with the one end portion of the tubular body and the plunger; 
 setting the mold in the second through hole; 
 filling the second through hole with the molten resin; and 
 removing the mold after the molten resin is solidified, thereby forming the third through hole. 
 
   
   
     4. The manufacturing method as set forth in  claim 1 , further comprising: forming a recessed portion on an inner face of the second through hole before the molten resin is injected. 
   
   
     5. The manufacturing method as set forth in  claim 1 , further comprising: forming a groove on at least one of faces of the conductive plate which are connected by the second through hole before the molten resin is injected, the groove being communicated with the second through hole. 
   
   
     6. The manufacturing method as set forth in  claim 1 , further comprising: forming a resin layer on a face of the conductive plate which is to be opposed to the device to be inspected.

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References (0)

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