Multilayer wiring board, base for multilayer wiring board, printed wiring board and its manufacturing method

Abstract

A multilayer wiring board assembly component comprises: an insulating substrate component (the insulating resin layer 111 ); a conductive layer 112 formed on one surface of said insulating substrate component 111 in the form of an electrode pattern; an adhesive layer 113 formed on the other surface of said insulating substrate component 111 ; and a conductive resin composition 115 with which is filled a through hole passing through said insulating substrate component 111 , said adhesive layer and said conductive layer in order to make interlayer interconnection. The bore diameter of the conductive layer portion 114 b of the through hole 114 is smaller than the bore diameter of the insulating resin layer portion and the adhesive layer portion 114 a to establish electrical connection between the conductive resin composition 115 and the conductive layer 112 by the rare surface 112 a of the conductive layer 112.

1. A multilayer wiring board assembly component comprising: an insulating substrate component; a conductive layer formed on one surface of said insulating substrate component in the form of an electrode pattern; and a conductive resin composition with which is filled a through hole passing through said insulating substrate component and said conductive layer in order to make interlayer interconnection,
 wherein said through hole has a bore diameter at said conductive layer which is smaller than a bore diameter at said insulating substrate component, and wherein both the portion of said through hole passing through said insulating substrate component and the portion of said through hole passing through said conductive layer are filled with said conductive resin composition. 
 
   
   
     2. A multilayer wiring board assembly comprising a plurality of multilayer wiring board assembly components each of which is constructed as set forth in  claim 1  and are laminated and joined together. 
   
   
     3. A multilayer wiring board assembly component comprising: an insulating substrate component; a conductive layer formed on one surface of said insulating substrate component in the form of an electrode pattern; an adhesive layer formed on the other surface of said insulating substrate component; and a conductive resin composition with which is filled a through hole passing through said insulating substrate component, said adhesive layer and said conductive layer in order to make interlayer interconnection,
 wherein said through hole has a bore diameter at said conductive layer which is smaller than a bore diameter at said insulating substrate component and said adhesive layer, and wherein the portion of said through hole passing through said insulating substrate component, the portion of said through hole passing through said adhesive layer and the portion of said through hole passing through said conductive layer are filled with said conductive resin composition. 
 
   
   
     4. A multilayer wiring board assembly comprising a plurality of multilayer wiring board assembly components each of which is constructed as set forth in  claim 3  and are laminated and joined together. 
   
   
     5. A multilayer wiring board assembly component comprising: an insulating substrate component; a conductive layer formed on one surface of said insulating substrate component in the form of an electrode pattern; and a conductive resin composition with which is filled a through hole passing through said insulating substrate component and said conductive layer in order to make interlayer interconnection,
 wherein said through hole has a bore diameter at said conductive layer which is smaller than a bore diameter at said insulating substrate component, and wherein the inner wall surface of said through hole at said insulating component portion has a curved profile as seen in a vertical cross section view. 
 
   
   
     6. A multilayer wiring board assembly comprising a plurality of multilayer wiring board assembly components each of which is constructed as set forth in  claim 5  and are laminated and joined together. 
   
   
     7. A multilayer wiring board assembly component comprising: an insulating substrate component; a conductive layer formed on one surface of said insulating substrate component in the form of an electrode pattern; an adhesive layer formed on the other surface of said insulating substrate component; and a conductive resin composition with which is filled a through hole passing through said insulating substrate component, said adhesive layer and said conductive layer in order to make interlayer interconnection,
 wherein said through hole has a bore diameter at said conductive layer which is smaller than a bore diameter at said insulating substrate component and said adhesive layer, and wherein the inner wall surface of said through hole at said insulating component portion has a curved profile as seen in a vertical cross section view. 
 
   
   
     8. A multilayer wiring board assembly comprising a plurality of multilayer wiring board assembly components each of which is constructed as set forth in  claim 7  are laminated and joined together. 
   
   
     9. A multilayer wiring board assembly component comprising: an insulating substrate component; a conductive layer formed on one surface of said insulating substrate component in the form of an electrode pattern; and a conductive resin composition with which is filled a through hole passing through said insulating substrate component and said conductive layer in order to make interlayer interconnection,
 wherein said through hole comprising an insulating layer through hole which is opened through said insulating component, at least one conductive layer through hole which is opened through said conductive layer in order to communicate with said insulating layer through hole, wherein the horizontal cross sectional area of said conductive layer through hole is smaller than the horizontal cross sectional area of said insulating layer through hole while the total area of the inner side wall of said conductive layer throughhole is larger than the horizontal cross sectional area of said conductive layer through hole, and 
 wherein both said insulating layer through hole and said conductive layer through hole are filled with said conductive resin composition. 
 
   
   
     10. A multilayer wiring board assembly comprising a plurality of multilayer wiring board assembly components each of which is constructed as set forth in  claim 9  are laminated and joined together. 
   
   
     11. A multilayer wiring board assembly component comprising: an insulating substrate component; a conductive layer formed on one surface of said insulating substrate component in the form of an electrode pattern; an adhesive layer formed on the other surface of said insulating substrate component; and a conductive resin composition with which is filled a through hole passing through said insulating substrate component, said adhesive layer and said conductive layer in order to make interlayer interconnection,
 wherein said through hole comprising an insulating layer through hole which is opened through said insulating component and said adhesive layer, at least one conductive layer through hole which is opened through said conductive layer in order to communicate with said insulating layer through hole, wherein the horizontal cross sectional area of said conductive layer through hole is smaller than the horizontal cross sectional area of said insulating layer through hole while the total area of the inner side wall of said conductive layer through hole is larger than the horizontal cross sectional area of said conductive layer through hole, and 
 wherein both said insulating layer through hole and said conductive layer through hole are filled with said conductive resin composition. 
 
   
   
     12. A multilayer wiring board assembly comprising a plurality of multilayer wiring board assembly components each of which is constructed as set forth in  claim 11  are laminated and joined together. 
   
   
     13. A multilayer wiring board assembly component comprising: an insulating substrate component; a conductive layer formed on one surface of said insulating substrate component in the form of an electrode pattern; and a conductive resin composition with which is filled a through hole passing through said insulating substrate component and said conductive layer in order to make interlayer interconnection,
 wherein said through hole comprising an insulating layer through hole which is opened through said insulating component, at least one conductive layer through hole which is opened through said conductive layer in order to communicate with said insulating layer through hole, wherein said insulating layer through hole and said conductive layer through hole are filled with the conductive resin composition in order that the total contact area of said conductive resin composition with said conductive layer in the case where said conductive layer through hole is formed is larger than that in the case where the formation of said conductive layer through hole is dispensed with. 
 
   
   
     14. A multilayer wiring board assembly comprising a plurality of multilayer wiring board assembly components each of which is constructed as set forth in  claim 13  are laminated and joined together. 
   
   
     15. A multilayer wiring board assembly component comprising: an insulating substrate component; a conductive layer formed on one surface of said insulating substrate component in the form of an electrode pattern; a through hole opened through said insulating component and said conductive layer and has a bore diameter at said conductive layer which is smaller than a bore diameter at said insulating substrate component; a conductive resin composition with which said through hole is filled in order to make interlayer interconnection; and a metallic layer formed on the surface of said conductive layer in order to cover said conductive resin composition exposed through an opening of said through hole in said conductive layer. 
   
   
     16. A multilayer wiring board assembly comprising a plurality of multilayer wiring board assembly components each of which is constructed as set forth in  claim 15  are laminated and joined together. 
   
   
     17. A multilayer wiring board assembly comprising a plurality of multilayer wiring board assembly components which are laminated and joined together and each of which comprising: an insulating substrate component; a conductive layer formed on one surface of said insulating substrate component in the form of an electrode pattern; a through hole opened through said insulating component and said conductive layer and has a bore diameter at said conductive layer which is smaller than a bore diameter at said insulating substrate component; and a conductive resin composition with which said through hole is filled in order to make interlayer interconnection, wherein a metallic layer is formed on the surface of said conductive layer in order to cover said conductive resin composition exposed through an opening of at least the most outer through hole of the through holes of said insulating components in the corresponding the conductive layer. 
   
   
     18. A multilayer wiring board assembly component comprising: an insulating substrate component; a conductive layer formed on one surface of said insulating substrate component in the form of an electrode pattern; and a conductive resin composition with which is filled a through hole passing through said insulating substrate component and said conductive layer in order to make interlayer interconnection, wherein said through hole has a bore diameter at said conductive layer which is smaller than a bore diameter at said insulating substrate component, wherein said conductive resin composition is composed of a resin binder, metal particles dispersed in said resin binder, and wherein the bore diameter of said through hole at said conductive layer is larger than the maximum diameter of said metal particles and smaller than three times the maximum diameter of said metal particles. 
   
   
     19. A multilayer wiring board assembly comprising a plurality of multilayer wiring board assembly components each of which is constructed as set forth in  claim 18  are laminated and joined together. 
   
   
     20. A multilayer wiring board assembly component comprising: an insulating substrate component; a conductive layer formed on one surface of said insulating substrate component in the form of an electrode pattern; an adhesive layer formed on the other surface of said insulating substrate component; and a conductive resin composition with which is filled a through hole passing through said insulating substrate component, said adhesive layer and said conductive layer in order to make interlayer interconnection,
 wherein said through hole has a bore diameter at said conductive layer which is smaller than a bore diameter at said insulating substrate component and said adhesive layer, and wherein the bore diameter of said through hole at said conductive layer is larger than the maximum diameter of said metal particles and smaller than three times the maximum diameter of said metal particles. 
 
   
   
     21. A multilayer wiring board assembly comprising a plurality of multilayer wiring board assembly components each of which is constructed as set forth in  claim 20  are laminated and joined together. 
   
   
     22. A multilayer wiring board assembly component comprising: an insulating substrate component; a conductive layer formed on one surface of said insulating substrate component in the form of an electrode pattern; and a conductive resin composition with which is filled a through hole passing through said insulating substrate component and said conductive layer in order to make interlayer interconnection, wherein said through hole has a bore diameter at said conductive layer which is larger than 1/10 and smaller than ½ of a bore diameter at said insulating substrate component. 
   
   
     23. A multilayer wiring board assembly comprising a plurality of multilayer wiring board assembly components each of which is constructed as set forth in  claim 22  are laminated and joined together. 
   
   
     24. A multilayer wiring board assembly component comprising: an insulating substrate component; a conductive layer formed on one surface of said insulating substrate component in the form of an electrode pattern; an adhesive layer formed on the other surface of said insulating substrate component; and a conductive resin composition with which is filled a through hole passing through said insulating substrate component, said adhesive layer and said conductive layer in order to make interlayer interconnection,
 wherein said through hole has a bore diameter at said conductive layer which is larger than 1/10 and smaller than ½ of a bore diameter at said insulating substrate component. 
 
   
   
     25. A multilayer wiring board assembly comprising a plurality of multilayer wiring board assembly components each of which is constructed as set forth in  claim 24  are laminated and joined together. 
   
   
     26. A multilayer wiring board assembly component comprising: an insulating substrate component; a conductive layer formed on one surface of said insulating substrate component in the form of an electrode pattern; and a conductive resin composition with which is filled a through hole passing through said insulating substrate component and said conductive layer in order to make interlayer interconnection, wherein said through hole has a bore diameter at said conductive layer which is smaller than a bore diameter at said insulating substrate component, and wherein the center position of said through hole at said insulating component falls within said through hole at said conductive layer. 
   
   
     27. A multilayer wiring board assembly comprising a plurality of multilayer wiring board assembly components each of which is constructed as set forth in  claim 26  are laminated and joined together. 
   
   
     28. A multilayer wiring board assembly component comprising: an insulating substrate component; a conductive layer formed on one surface of said insulating substrate component in the form of an electrode pattern; an adhesive layer formed on the other surface of said insulating substrate component; and a conductive resin composition with which is filled a through hole passing through said insulating substrate component, said adhesive layer and said conductive layer in order to make interlayer interconnection,
 wherein said through hole has a bore diameter at said conductive layer which is smaller than a bore diameter at said insulating substrate component and said adhesive layer, and wherein the center position of said through hole at said insulating component falls within said through hole at said conductive layer. 
 
   
   
     29. A multilayer wiring board assembly comprising a plurality of multilayer wiring board assembly components each of which is constructed as set forth in  claim 28  are laminated and joined together. 
   
   
     30. A multilayer wiring board assembly component comprising: an insulating substrate component; a conductive layer formed on one surface of said insulating substrate component in the form of an electrode pattern; and a conductive resin composition with which is filled a through hole passing through said insulating substrate component and said conductive layer in order to make interlayer interconnection, wherein said through hole has a bore diameter at said conductive layer which is smaller than a bore diameter at said insulating substrate component, and wherein the bore diameter of said through hole at the surface of said conductive layer facing said insulating component is larger than the bore diameter of said through hole at the opposite surface of said conductive layer which is not facing said insulating component. 
   
   
     31. A multilayer wiring board assembly comprising a plurality of multilayer wiring board assembly components each of which is constructed as set forth in  claim 30  are laminated and joined together. 
   
   
     32. A multilayer wiring board assembly component comprising: an insulating substrate component; a conductive layer formed on one surface of said insulating substrate component in the form of an electrode pattern; an adhesive layer formed on the other surface of said insulating substrate component; and a conductive resin composition with which is filled a through hole passing through said insulating substrate component, said adhesive layer and said conductive layer in order to make interlayer interconnection,
 wherein said through hole has a bore diameter at said conductive layer which is smaller than a bore diameter at said insulating substrate component and said adhesive layer, and wherein the bore diameter of said through hole at the surface of said conductive layer facing said insulating component is larger than the bore diameter of said through hole at the opposite surface of said conductive layer which is not facing said insulating component. 
 
   
   
     33. A multilayer wiring board assembly comprising a plurality of multilayer wiring board assembly components each of which is constructed as set forth in  claim 32  are laminated and joined together. 
   
   
     34. A printed circuit board for use in a multilayer substrate in which interlayer interconnection is established by a conductive paste with which a via hole is filled,
 wherein a substrate electrode is provided and located in order to be aligned with said via hole, and wherein a small opening is opened in said substrate electrode as a tapered hole having a larger diameter at the surface of said substrate electrode than a diameter at said via hole. 
 
   
   
     35. A printed circuit board for use in a multilayer substrate in which interlayer interconnection is established by a conductive paste with which a via hole is filled,
 wherein a substrate electrode is provided and located in order to be aligned with said via hole; wherein a small opening is opened in said substrate electrode as a tapered hole having a larger diameter at the surface of said substrate electrode than a diameter at said via hole; wherein the surface of said substrate electrode is covered with a metallic layer; and wherein the surface location of said metallic layer corresponding to said small opening is made concave.