Substrate structure, substrate manufacturing method and electronic device

Abstract

According to one embodiment, there is provided a substrate structure including a printed-wiring board. A micro-contact sheet is soldered to the printed-wiring board, and includes a spiral terminal on a first surface thereof and a pad on a second surface thereof. The pad is electrically connected to the spiral terminal. A holding jig presses the micro-contact sheet against the printed-wiring board such that the second surface of the micro-contact sheet contacts with the printed-wiring board.

1. A substrate structure, comprising:
 a printed-wiring board; 
 a micro-contact sheet soldered to the printed-wiring board, and including a spiral terminal on a first surface thereof and a pad on a second surface thereof, the pad being electrically connected to the spiral terminal; and 
 a holding jig which presses the micro-contact sheet against the printed-wiring board such that the second surface of the micro-contact sheet contacts with the printed-wiring board. 
 
   
   
     2. The substrate structure according to  claim 1 , wherein the spiral terminal includes a protruding end. 
   
   
     3. The substrate structure according to  claim 2 , wherein the holding jig includes a first surface which presses the micro-contact sheet against the printed-wiring board, and a second surface which is vacuumed up by an automated machine, the first surface including a concave portion corresponding to the spiral terminal,
 wherein the holding jig is removed from the micro-contact sheet after the micro-contact sheet is soldered to the printed-wiring board. 
 
   
   
     4. The substrate structure according to  claim 1 , wherein the holding jig includes a first surface which presses the micro-contact sheet against the printed-wiring board, and a second surface which is vacuumed up by an automated machine, the first surface including a concave portion corresponding to the spiral terminal,
 wherein the holding jig is removed from the micro-contact sheet after the micro-contact sheet is soldered to the printed-wiring board. 
 
   
   
     5. The substrate structure according to  claim 4 , wherein the printed-wiring board includes a mounting portion for mounting a socket for mounting an electronic component on the micro-contact sheet, and
 the holding jig includes an engaging portion in the first surface thereof, the engaging portion engaging with the mounting portion. 
 
   
   
     6. The substrate structure according to  claim 5 , wherein the spiral terminal is pressed against and contacts with a terminal of the electronic component mounted to the socket at a position higher than the first surface of the micro-contact sheet, thereby establishing an electrical connection between the spiral terminal and the terminal of the electronic component. 
   
   
     7. The substrate structure according to  claim 6 , wherein the spiral terminal is pressed against and contacts with a ball-like terminal provided to the electronic component, thereby establishing an electrical connection between the spiral terminal and the terminal of the electronic component. 
   
   
     8. The substrate structure according to  claim 6 , wherein the spiral terminal is pressed against and contacts with a flat terminal provided to the electronic component, thereby establishing an electrical connection between the spiral terminal and the terminal of the electronic component. 
   
   
     9. The substrate structure according to  claim 6 , wherein the socket includes:
 a frame body contacting with a periphery of the micro-contact sheet; and 
 a cover which is engaged with the frame body, presses the electronic component in a direction of a surface of the printed-wiring board, and maintains a state where the terminal of the electronic component is pressed against and contacts with the spiral terminal provided on the micro-contact sheet. 
 
   
   
     10. The substrate structure according to  claim 9 , wherein the frame body includes a first through hole, the micro-contact sheet includes a second through hole, each of the first through hole and the second through hole corresponding to the mounting portion of the printed-wiring board, the socket is fixed to the printed-wiring board by interposing the micro-contact sheet therebetween by using a fixing member which is inserted through the first through hole and the second through hole and is fixed to the mounting portion. 
   
   
     11. A substrate manufacturing method, comprising:
 pressing a micro-contact sheet against a printed-wiring board by a holding member such that the micro-contact sheet contacts with the printed-wiring board, the micro-contact sheet including a spiral terminal on a first surface thereof and a pad on a second surface thereof, the pad being electrically connected to the spiral terminal; and 
 soldering the micro-contact sheet to the printed-wiring board.