Modified epoxy resins

Abstract

The present invention relates to molding compositions comprising A) from 40 to 99% by weight of at least one epoxy resin, B) from 1 to 60% by weight of at least one polyarylene ether sulfone containing side- or end-groups selected from the group consisting of carboxy groups and anhydride groups, C) from 0 to 60% by weight of at least one polyarylene ether sulfone containing essentially no side- or end-groups selected from the group consisting of carboxy and anhydride groups, D) from 0 to 60% by weight of at least one filler, and E) from 0 to 40% by weight of one or more various additives, where the percentages by weight of components A to E together give 100%, and also to a process for preparing these molding compositions, and to their use, and to moldings obtainable therefrom.

1. A molding composition comprising
 A) from 40 to 99% by weight of at least one epoxy resin obtained from one or more at least bifunctional epoxy compounds, 
 B) from 1 to 60% by weight of at least one polyarylene ether sulfone containing side-groups selected from the group consisting of carboxy groups, 
 C) from 0 to 60% by weight of at least one polyarylene ether sulfone containing essentially no side or end groups selected from the group consisting of carboxy and anhydride groups, 
 D) from 0 to 60% by weight of at least one filler, and 
 E) from 0 to 40% by weight of one or more various additives, 
 
       where the percentages by weight of components A to E together give 100%. 
     
     
       2. A molding composition as claimed in  claim 1 , wherein the molding composition is a thermosetting molding composition, in which the epoxy resin A is obtained from
 a1) one or more at least bifunctional epoxy compounds, 
 
       and in addition thereto from the optional components
 a2) one or more hardeners, and/or 
 a3) one or more accelerators. 
 
     
     
       3. A molding composition as claimed in  claim 1 , in which the polyarylene ether sulfones B comprise
 from 0 to 100 mol % of repeat units I1 
 
       
         
           
           
               
               
           
         
          and 
         from 0 to 100 mol % of repeat units I2 
       
       
         
           
           
               
               
           
         
         where the molar percentages of repeat units of the formulae I1 and I2 together give 100 mol %, and where the units I1 and I2 also contain, based on the total weight of component B, from 0.1 to 15% by weight of side-groups selected from the group consisting of carboxy groups. 
       
     
     
       4. A molding composition as claimed in  claim 1 , in which the polyarylene ether sulfones C comprise
 from 0 to 100 mol % of repeat units I1, and 
 from 0 to 100 mol % of repeat units I2, 
 where the molar percentages of repeat units of the formulae I1 and I2 together give 100 mol %. 
 
     
     
       5. A process for preparing molding compositions as claimed in  claim 1 , which comprises, in a first step, mixing component B and optionally C, D, and/or E with one or more as yet still at least partially unreacted at least bifunctional epoxy compound (a1) and optionally one or more hardeners (a2) and/or one or more accelerators (a3), and, in a second step, completely hardening the epoxy compound(s) (a1) and, where present, the hardener(s) (a2) and/or the accelerator(s) (a3). 
     
     
       6. A method for molding which comprises molding the composition as claimed in  claim 1 . 
     
     
       7. A molding obtained from the molding compositions as claimed in  claim 1 . 
     
     
       8. A molding composition as claimed in  claim 1 , in which the epoxy resin A is obtained from a1) one or more at least bifunctional epoxy compounds, and in addition thereto components a2) one or more hardeners. 
     
     
       9. A molding composition as claimed in  claim 1 , in which the epoxy resin A is obtained from al) one or more at least bifunctional epoxy compounds, selected from the group consisting of bisphenol A diglycidyl ether, bisphenol F diglycidyl ether, resorcinol diglycidyl ether, triglycidyl ethers of para-aminophenols.