Thermally-enhanced circuit assembly

Abstract

A circuit assembly for mounting one or more integrated circuits that effectively dissipates heat generated by the integrated circuits, and a corresponding method for fabricating such a circuit assembly. The circuit assembly comprises a substrate, a thermally-conductive adhesive layer and a heat-dissipating layer. The substrate includes an opening extending between a first surface and a second surface of the substrate. An integrated circuit is to be mounted on the first surface of the substrate substantially coincident with the opening. The thermally-conductive adhesive layer is at least partially disposed within the opening in the substrate. The heat-dissipating layer is disposed on the second surface of the substrate and includes a raised portion that at least partially extends through the opening in the substrate.

1. A circuit assembly for mounting an integrated circuit, comprising:
 a substrate including an opening extending between a first surface and a second surface of the substrate, wherein the integrated circuit is to be mounted on the first surface substantially coincident with the opening; 
 a thermally-conductive adhesive layer at least partially disposed within the opening in the substrate; and 
 a heat-dissipating layer disposed on the second surface of the substrate and including a raised portion that at least partially extends through the opening in the substrate. 
 
     
     
       2. The circuit assembly of  claim 1 , wherein:
 the integrated circuit comprises a die; and 
 the substrate comprises a flexible circuit substrate. 
 
     
     
       3. The circuit assembly of  claim 1 , wherein a cross-sectional area of the opening at the first surface of the substrate differs from a cross-sectional area of the opening at the second surface of the substrate. 
     
     
       4. The circuit assembly of  claim 1 , wherein the thermally-conductive adhesive layer is composed of a material having a thermal conductivity of approximately 0.6 W/m·K or greater. 
     
     
       5. The circuit assembly of  claim 1 , wherein the thermally-conductive adhesive layer is composed of a material having a thermal conductivity of approximately 1.0 W/m·K or greater. 
     
     
       6. The circuit assembly of  claim 1 , wherein the thermally-conductive adhesive layer is at least partially composed of an underfill material. 
     
     
       7. The circuit assembly of  claim 1 , wherein the heat-dissipating layer is at least partially composed of a metallic material. 
     
     
       8. A circuit assembly, comprising:
 a flexible substrate including an opening extending between a first surface and a second surface of the substrate; 
 an integrated circuit die disposed on the first surface of the substrate substantially coincident with the opening in the substrate; 
 a thermally-conductive adhesive layer at least partially disposed within the opening in the substrate; and 
 a heat-dissipating layer disposed on the second surface of the substrate and including a raised portion that at least partially extends through the opening in the substrate. 
 
     
     
       9. The circuit assembly of  claim 8 , wherein a cross-sectional area of the opening at the first surface of the substrate differs from a cross-sectional area of the opening at the second surface of the substrate. 
     
     
       10. The circuit assembly of  claim 8 , wherein the thermally-conductive adhesive layer is composed of a material having a thermal conductivity of approximately 0.6 W/m·K or greater. 
     
     
       11. The circuit assembly of  claim 8 , wherein the thermally-conductive adhesive layer is composed of a material having a thermal conductivity of approximately 1.0 W/m·K or greater. 
     
     
       12. The circuit assembly of  claim 8 , wherein the thermally-conductive adhesive layer is at least partially composed of an underfill material. 
     
     
       13. The circuit assembly of  claim 8 , wherein the heat-dissipating layer is at least partially composed of a metallic material. 
     
     
       14. A method of fabricating a circuit assembly, comprising the steps of:
 providing a substrate including an opening extending between a first surface and a second surface of the substrate; 
 providing a heat-dissipating layer including a raised portion; 
 placing the heat-dissipating layer on the first surface of the substrate such that the raised portion at least partially extends through the opening in the substrate; 
 depositing a thermally-conductive adhesive material into the opening in the substrate; and 
 placing an integrated circuit on the second surface of the substrate substantially coincident with the opening in the substrate. 
 
     
     
       15. The method of  claim 14 , wherein:
 the substrate comprises a flexible circuit substrate; and 
 the integrated circuit comprises a die. 
 
     
     
       16. The method of  claim 14 , wherein a cross-sectional area of the opening at the first surface of the substrate differs from a cross-sectional area of the opening at the second surface of the substrate. 
     
     
       17. The method of  claim 14 , wherein the heat-dissipating layer is at least partially composed of a metallic material. 
     
     
       18. The method of  claim 14 , wherein the thermally-conductive adhesive material has a thermal conductivity of approximately 0.6 W/m·K or greater. 
     
     
       19. The method of  claim 14 , wherein the thermally-conductive adhesive material has a thermal conductivity of approximately 1.0 W/m·K or greater. 
     
     
       20. The method of  claim 14 , wherein the thermally-conductive adhesive material is at least partially an underfill material.