P
US7362131B2ExpiredUtilityPatentIndex 92

Integrated circuit including programmable logic and external-device chip-enable override control

Assignee: ACTEL CORPPriority: Jul 31, 2003Filed: Apr 7, 2006Granted: Apr 22, 2008
Est. expiryJul 31, 2023(expired)· nominal 20-yr term from priority
Inventors:BALASUBRAMANIAN RABINDRANATHKOLKIND KURTBAKKER GREGORY
H03K 19/17732G06F 1/08H03F 2203/45136G06F 1/28G06F 15/7867H03K 19/1776G06F 1/30H03F 3/45475H03F 2203/45166H03K 19/177H03K 17/223G01K 7/015G06F 15/7842
92
PatentIndex Score
11
Cited by
79
References
21
Claims

Abstract

An integrated circuit device includes a programmable logic block, a monitoring input, a condition-sensing circuit coupled to the monitoring input and configured to generate a condition-sensed signal at an output in response to sensing a condition at the monitoring input, a first digital input, a first digital output, and a gating circuit configured in the programmable logic block and coupled between the first digital input and the first digital output. The gating circuit has a gating input coupled to the condition-sensing circuit and generates an output. The output is related to an input state of the first digital input in the absence of the condition-sensed signal and assumes an override state in the presence of the condition-sensed signal.

Claims

exact text as granted — not AI-modified
1. A programmable system-on-a-chip integrated circuit device comprising:
 a programmable logic block 
 a digital input/output circuit block; 
 a non-volatile memory block; 
 an analog circuit block including an analog-to-digital converter, at least one temperature-sensing circuit coupled to an I/O pad, the temperature-sensing circuit including a programmable voltage prescaling circuit; 
 an analog input/output circuit block; 
 a clock generator circuit and distribution block including at least one RC oscillator, a crystal oscillator circuit coupled to I/O pads for coupling to an external crystal, at least one phase locked loop circuit, at least one I/O pad for coupling to an external clock source; and 
 a programmable interconnect architecture including programmable elements and interconnect conductors, ones of said programmable elements coupled to said programmable logic block, said non-volatile memory block, said analog circuit block, said analog input/output circuit block, said digital input/output circuit block, and to said interconnect conductors, such that inputs and outputs of said programmable logic block, said non-volatile memory block, said analog circuit block, said analog input/output circuit block, and said digital input/output circuit block can be programmably coupled to one another. 
 
     
     
       2. The programmable system-on-a-chip integrated circuit device of  claim 1  further including a static random-access memory block and wherein said programmable interconnect architecture is coupled to said static random-access memory block. 
     
     
       3. The programmable system-on-a-chip integrated circuit device of  claim 2  wherein said static random-access memory block is configured into at least two sub-blocks. 
     
     
       4. The programmable system-on-a-chip integrated circuit device of  claim 1  further including a microcontroller block and a static random-access memory block and wherein said programmable interconnect architecture is coupled to said microcontroller block and said static random-access memory block. 
     
     
       5. The programmable system-on-a-chip integrated circuit device of  claim 4  wherein said static random-access memory block is configured into at least two sub-blocks. 
     
     
       6. The programmable system-on-a-chip integrated circuit device of  claim 1  further including a microprocessor block and a static random-access memory block and wherein said programmable interconnect architecture is coupled to said microprocessor block and said static random-access memory block. 
     
     
       7. The programmable system-on-a-chip integrated circuit device of  claim 6  wherein said static random-access memory block is configured into at least two sub-blocks. 
     
     
       8. The programmable system-on-a-chip integrated circuit device of  claim 1  wherein said non-volatile memory block comprises flash memory. 
     
     
       9. The programmable system-on-a-chip integrated circuit device of  claim 1  further including a digital input circuit coupled to said I/O pad. 
     
     
       10. The programmable system-on-a-chip integrated circuit device of  claim 1  wherein said analog circuit block further includes at least one voltage-sensing circuit coupled to an I/O pad. 
     
     
       11. The programmable system-on-a-chip integrated circuit device of  claim 10  wherein said at least one voltage-sensing circuit includes a programmable voltage prescaling circuit. 
     
     
       12. The programmable system-on-a-chip integrated circuit device of  claim 10  further including a digital input circuit coupled to said I/O pad. 
     
     
       13. The programmable system-on-a-chip integrated circuit device of  claim 1  wherein said analog circuit block further includes at least one current-sensing circuit coupled to a first I/O pad and a second I/O pad. 
     
     
       14. The programmable system-on-a-chip integrated circuit device of  claim 13  wherein said at least one current-sensing circuit includes a programmable voltage prescaling circuit. 
     
     
       15. The programmable system-on-a-chip integrated circuit device of  claim 13  further including a digital input circuit coupled to at least one of said first and second I/O pads. 
     
     
       16. The programmable system-on-a-chip integrated circuit device of  claim 1  wherein said analog circuit block further includes at least one programmable MOSFET gate-drive circuit coupled to an I/O pad. 
     
     
       17. The programmable system-on-a-chip integrated circuit device of  claim 1  wherein said analog circuit block further includes:
 at least one MOSFET gate-drive circuit coupled to a first I/O pad, 
 at least one voltage-sensing circuit coupled to a second I/O pad; 
 at least one current-sensing circuit coupled to said second I/O pad and a third I/O pad; and 
 at least one temperature-sensing circuit coupled to a fourth I/O pad. 
 
     
     
       18. The programmable system-on-a-chip integrated circuit device of  claim 17  further including a digital input circuit coupled to one of said second, third, and fourth I/O pads. 
     
     
       19. The programmable system-on-a-chip integrated circuit device of  claim 1  wherein said non-volatile memory block has a first segment that may be programmably connected to a user-configured circuit and a second segment that may not be programmably connected to a user-configured circuit. 
     
     
       20. The programmable system-on-a-chip integrated circuit device of  claim 1  further including a bandgap reference circuit. 
     
     
       21. The programmable system-on-a-chip integrated circuit device of  claim 1  further including a glitchless clock multiplexer coupled between at least two of the at least one RC oscillator, the crystal oscillator circuit coupled to I/O pads for coupling to an external crystal, the at least one phase locked loop circuit, and the at least one I/O pad for coupling to an external clock source.

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