Apparatus and method for miniature semiconductor packages

Abstract

A method and apparatus for making reliable miniature semiconductor packages having a reduced height and footprint is provided. The package includes a semiconductor chip having an active surface and a non-active surface and one or more contacts positioned adjacent the semiconductor chip. Electrical connections are formed between the contacts and the semiconductor chip. An adhesive tape provided adjacent the non-active surface of the semiconductor chip and the one or more contacts positioned adjacent the semiconductor chip. An adhesive material provided between the non-active surface of the chip and the adhesive tape.

1. A method for packaging a semiconductor chip, comprising:
 fabricating a semiconductor chip having an active surface and a non-active surface; 
 applying an adhesive material in direct contact with the non-active surface of the chip; 
 applying an adhesive tape over the adhesive material adjacent the non-active surface of the semiconductor chip so that the adhesive material is provided between the non-active surface and the adhesive tape; and 
 positioning the semiconductor chip onto a plurality of contacts, each of the contacts having a first end of varying lengths relative to one another, such that the adhesive tape adjacent the non-active surface of the semiconductor chip is in contact with the plurality of contacts, the varying lengths of the plurality of contacts providing support surfaces for the semiconductor chip, whereby the plurality of contacts entirely support the semiconductor chip without the use of a die attach pad. 
 
     
     
       2. The method of  claim 1 , wherein applying the adhesive material further comprises applying a non-conductive epoxy. 
     
     
       3. The method of  claim 1 , wherein applying the adhesive material further comprises applying a conductive epoxy. 
     
     
       4. The method of  claim 1 , wherein applying the adhesive material further comprises applying a silver resin. 
     
     
       5. The method of  claim 1 , wherein applying the adhesive material further comprises applying a double-stick die adhesive film to the non-active surface of the semiconductor device. 
     
     
       6. The method of  claim 1 , wherein the contacts are leads. 
     
     
       7. The method of  claim 1 , further comprising etching a first surface of the leads. 
     
     
       8. The method of  claim 7 , further comprising a second surface of the leads. 
     
     
       9. The method of  claim 1 , further comprising forming electrical contacts between the plurality of contacts and the active surface of the semiconductor chip and encapsulating the semiconductor chip in an encapsulating material. 
     
     
       10. A method comprising:
 providing one or more leads, the one or more leads each having a first end of varying lengths with respect to one another; 
 providing a semiconductor chip having an active surface and a non-active surface, the non-active surface of the semiconductor chip being supported by the varying lengths of the first ends of the one or more leads respectively; 
 applying an adhesive material onto and in direct contact with the non-active surface of the semiconductor chip; and 
 attaching an adhesive tape to the adhesive material, the adhesive tape acting to adhere the semiconductor chip onto the one or more leads, whereby the semiconductor chip is entirely supported on the one or more leads without a die attach pad. 
 
     
     
       11. The method of  claim 10 , wherein applying the adhesive material further comprises applying a non-conductive epoxy. 
     
     
       12. The method of  claim 10 , wherein applying the adhesive material further comprises applying a conductive epoxy. 
     
     
       13. The method of  claim 10 , wherein applying the adhesive material further comprises applying a silver resin. 
     
     
       14. The method of  claim 10 , wherein applying the adhesive material further comprises applying a double-stick die attach film. 
     
     
       15. The method of  claim 10 , further comprising etching a first surface of the leads. 
     
     
       16. The method of  claim 15 , further comprising etching a second surface of the leads. 
     
     
       17. The method of  claim 10 , further comprising forming electrical connections between the leads and contacts on the active surface of the semiconductor chip. 
     
     
       18. The method of  claim 10 , further comprising encapsulating the semiconductor chip and a portion of the leads so that the non-encapsulated portion of the leads are exposed.