Electronically and ionically conductive porous material and method for manufacture of resin wafers therefrom

Abstract

An electrically and ionically conductive porous material including a thermoplastic binder and one or more of anion exchange moieties or cation exchange moieties or mixtures thereof and/or one or more of a protein capture resin and an electrically conductive material. The thermoplastic binder immobilizes the moieties with respect to each other but does not substantially coat the moieties and forms the electrically conductive porous material. A wafer of the material and a method of making the material and wafer are disclosed.

1. An electrically and ionically conductive porous material, comprising a thermoplastic binder and one or more of anion exchange moieties or cation exchange moieties or mixtures thereof and/or one or more of a protein capture resin and an electrically conductive material,
 wherein said thermoplastic binder immobilizes the moieties with respect to each other but does not substantially coat the moieties and forms the electrically conductive porous material. 
 
     
     
       2. The electrically and ionically conductive porous material of  claim 1 , wherein anion and/or cation exchange moieties are present in the range of from about 30% to about 75% by weight of the material and wherein said thermoplastic binder is present in the range of from about 25% to about 70% by weight of the material. 
     
     
       3. The electrically and ionically conductive porous material of  claim 1 , wherein a protein capture resin is present. 
     
     
       4. The electrically and ionically conductive porous material of  claim 1 , wherein said binder includes polyethylene. 
     
     
       5. The electrically and ionically conductive porous material of  claim 1 , wherein said electrically conductive material is one or more of carbon black or glassy carbon particles or glassy carbon nanoparticles and is present in the range of from about 1 to about 15% by weight of the electrically conductive flexible and porous material. 
     
     
       6. The electrically and ionically conductive porous material of  claim 2 , wherein said material has a porosity in the range of from about 15% to about 60%. 
     
     
       7. The electrically and ionically conductive porous material of  claim 3 , wherein protein capture resins are present and are Ni-charged polymers. 
     
     
       8. The electrically conductive porous material of  claim 5 , wherein said electrically conductive material is in the form of particles having an average diameter of less than about 100 nanometers. 
     
     
       9. A thin wafer of electrically and ionically conductive porous material, comprising
 a mixture of a thermoplastic binder and one or more of anion exchange moieties or cation exchange moieties or mixtures thereof and/or one or more of a protein capture resin and an electrically conductive material into a mold, 
 wherein said anion and/or cation exchange moieties are present in the range of from about 30% to about 75% by weight of the material and wherein said thermoplastic binder is present in the range of from about 25% to about 70% by weight of the material and said electrically conductive material is one or more of carbon black or glassy carbon particles or glassy carbon nanoparticles and is present in the range of from about 1 to about 15% by weight of the electrically and ionically conductive flexible and porous material. 
 
     
     
       10. The thin wafer of  claim 9 , wherein said thermoplastic binder has a melting point in the range of from about 60° C. to about 240° C. 
     
     
       11. The thin wafer of  claim 10 , wherein said thermoplastic polymer is or includes polyethylene and said material has a porosity in the range of from about 15% to about 60%. 
     
     
       12. The thin wafer of  claim 11 , wherein protein capture resins are present and are Ni-charged resins. 
     
     
       13. The thin wafer of  claim 9 , wherein the wafer thickness is in the range of from about 1 mm to about 12 mm. 
     
     
       14. The thin wafer of  claim 9 , wherein said wafer is flexible when wet and relatively rigid when dry. 
     
     
       15. The electrically conductive porous wafer of  claim 9 , wherein said electrically conductive material is in the form of particles having an average diameter of less than about 100 nanometers.