Material for manufacturing display panel substrate assembly and process for manufacturing display panel substrate assembly

Abstract

A material for manufacturing a display panel substrate assembly having at least an electrode and a dielectric layer covering the electrode on a glass substrate, the material including an electrode material containing an electrically conductive particle and a binder resin having a thermal degradation temperature T 1 , and a dielectric material containing a binder resin having a thermal degradation temperature T 2 and a low melting point glass having a glass softening point Tb, wherein the thermal degradation temperatures T 1 and T 2 , and the glass softening point Tb have a relationship of T 2 <T 1 <Tb.

1. A material for manufacturing a display panel substrate assembly having at least an electrode, an dielectric layer covering the electrode, and a rib formed on the dielectric layer on a glass substrate, the material comprising an electrode material containing an electrically conductive particle and a binder resin having a thermal degradation temperature of T 1 , a dielectric material containing a binder resin having a thermal degradation temperature T 2  and a low melting point glass having a glass softening point Tb, and a rib material containing a binder resin having a thermal degradation temperature T 3  and a low melting point glass having a glass softening point Tc, wherein the thermal degradation temperatures T 1  to T 3 , and the glass softening points Tb and Tc have a relationship of T 3 <T 2 <T 1 <Tb and T 3 <Tc. 
     
     
       2. The material for manufacturing a display panel substrate assembly of  claim 1 , wherein the electrode material contains a low melting point glass having a glass softening point Ta, and the thermal degradation temperatures of T 1  and T 2  and the glass softening point Ta have a relationship of T 2 <T 1 <Ta. 
     
     
       3. The material for manufacturing a display panel substrate assembly of  claim 2 , wherein the glass softening points Ta and Tb have a relationship of Ta<Tb. 
     
     
       4. The material for manufacturing a display panel substrate assembly of  claim 1 , wherein the display panel substrate assembly is a front substrate assembly or a rear substrate assembly of a plasma display panel. 
     
     
       5. A process for manufacturing a display panel substrate assembly having an electrode on a glass substrate, a dielectric layer covering the electrode, and a rib formed on the dielectric layer, the process comprising:
 forming an electrode material layer having a predetermined pattern on a glass substrate using an electrode material, 
 forming a dielectric material layer using a dielectric material so as to cover the electrode material layer, 
 forming a rib material layer having a predetermined pattern on the dielectric material layer using a rib material, and 
 firing the glass substrate having the formed electrode material layer, the formed dielectric material layer and the formed rib material layer, to degrade binder resins contained in the electrode material layer, the dielectric material layer and the rib material layer, and to soften and sinter low melting point glasses, whereby, an electrode, a dielectric layer and a rib are formed at the same time by one time firing, wherein
 the electrode material contains an electrically conductive particle and a binder resin having a thermal degradation temperature of T 1 , 
 the dielectric material contains a binder resin having a thermal degradation temperature T 2  and a low melting point glass having a glass softening point Tb, 
 the rib material contains a binder resin having a thermal degradation temperature T 3  and a low melting point glass having a glass softening point Tc, and 
 the thermal degradation temperatures T 1  to T 3  and the glass softening points Tb and Tc have a relationship of T 3 <T 2 <T 1 <Tb, and T 3 <Tc. 
 
 
     
     
       6. The process of  claim 5 , wherein temperature differences between T 3  and T 2 , T 2  and T 1 , T 1  and Tb, and T 3  and Tc are in a range of 20° C. to 50° C., respectively. 
     
     
       7. A process comprising:
 forming an electrode material layer having a predetermined pattern on a glass substrate using an electrode material, 
 forming a dielectric material layer using a dielectric material so as to cover the electrode material layer, 
 forming a rib material layer having a predetermined pattern on the dielectric material layer using a rib material, and 
 firing the glass substrate having the formed electrode material layer, the formed dielectric material layer and the formed rib material layer to degrade binder resins contained in the electrode material layer, the dielectric material layer and the rib material layer, and to soften and sinter low melting point glasses, to thereby form an electrode on the glass substrate, a dielectric layer covering the electrode and a rib on the dielectric layer, of a display panel substrate, at the same time by one time firing, wherein
 the electrode material contains an electrically conductive particle and a binder resin having a thermal degradation temperature of T 1 , 
 the dielectric material contains a binder resin having a thermal degradation temperature T 2  and a low melting point glass having a glass softening point Tb, 
 the rib material contains a binder resin having a thermal degradation temperature T 3  and a low melting point glass having a glass softening point Tc, 
 the thermal degradation temperatures T 1  to T 3  and the glass softening points Tb and Tc have a relationship of T 3 <T 2 <T 1 <Tb, and T 3 <Tc.