Method for manufacturing electronic component, and electronic component

Abstract

A method for manufacturing an electronic component includes preparing an element substrate having a function section for providing a function of an electronic component, and an external-connection electrode; bonding a low-sandblast-resistant case plate to the element substrate through a high-sandblast-resistant adhesive layer; forming, by sandblast processing, a hole in the case plate above the external-connection electrode so that the adhesive layer is exposed to the outside; removing, by etching, an adhesive layer portion that is exposed in the hole; forming an electrode film so as to be electrically connected to the exposed external-connection electrode; and forming, by mechanical machining, a projection having a leading end surface on which a terminal electrode resulting from the electrode film is defined.

1. A method for manufacturing an electronic component, comprising the steps of:
 preparing an element substrate having a function section arranged to provide a function of an electronic component and an external-connection electrode provided on a surface thereof and arranged to electrically connect the function section to an external device; 
 bonding a relatively-low-sandblast-resistant case plate to the element substrate using a relatively-high-sandblast-resistant adhesive; 
 forming, by sandblast processing, a hole in the case plate so that the adhesive is exposed on a portion of the hole beneath which a portion of the external-connection electrode is defined; 
 removing, by etching, an adhesive portion that is exposed in the hole and that is not removed by the sandblast processing to expose the external-connection electrode; 
 forming an electrode film so that the electrode film extends on an inner surface of the hole from an outer surface of the case plate and so that the electrode film is electrically connected to the external-connection electrode exposed by removing the adhesive; and 
 forming a projection on the outer surface of the case plate, the projection having a leading end surface on which the electrode film extends. 
 
     
     
       2. The method for manufacturing an electronic component according to  claim 1 , further comprising the step of, before forming the electrode film, roughening at least a portion of the case plate at which the electrode film is provided. 
     
     
       3. The method for manufacturing an electronic component according to  claim 1 , wherein the etching is performed by dry etching. 
     
     
       4. The method for manufacturing an electronic component according to  claim 1 , wherein a polyimide-based adhesive is used as the adhesive. 
     
     
       5. The method for manufacturing an electronic component according to  claim 1 , further comprising the step of dicing a laminate of the element substrate and the case plate so that the hole is divided, and forming a recess in a side surface of the projection, the recess being defined by a portion of an inner peripheral surface of the hole. 
     
     
       6. The method for manufacturing an electronic component according to  claim 1 , wherein the case plate is a first case plate, the method further comprising the step of laminating a second case plate on a surface opposite to the side of the element substrate on which the first case plate is adhered. 
     
     
       7. The method for manufacturing an electronic component according to  claim 6 , wherein the second case plate is bonded to the element substrate by an adhesive.