Process of manufacturing high frequency device packages

Abstract

A high frequency device packaging method is described wherein an insulating material, attached to a fiat surface, is selectively etched and the etched insulating material is plated with a conductive material to form a center conductor for a coaxial via structure.

1. A method of fabricating a conductive base structure with coaxial vias, comprising:
 selectively patterning an insulating material attached to a foundation layer to form an etched insulating material; 
 plating said etched insulating material with a conductive material to form the conductive base structure that includes a center conductor and a conductive shield surrounding the etched insulating material; and 
 separating the foundation layer from the etched insulating material, the center conductor, and the conductive shield, to form a coaxial via structure through the conductive base structure. 
 
     
     
       2. The method of  claim 1 , wherein the insulating material comprises SU- 8 . 
     
     
       3. The method of  claim 2  farther comprising glazing said insulating material layer. 
     
     
       4. The method of  claim 1  further comprising applying an adhesive layer to secure the insulating material to the foundation layer. 
     
     
       5. The method of  claim 4 , wherein applying the adhesive layer further comprises plating the adhesive layer with gold. 
     
     
       6. The method of  claim 4 , wherein applying the adhesive layer further comprises plating the adhesive layer with gold and then nickel.