Energy scavenger and method for manufacturing the same

Abstract

A micro-electromechanical package includes a casing and a microelectronic circuit. At least one portion of the casing includes a piezoelectric material arranged such that, in use, dynamically changing mechanical strain in the at least one portion produces an electrical charge usable as a power source by the microelectronic circuit.

1. A micro-electromechanical (MEMS) package, comprising:
 a casing, wherein at least one outer wall of the casing comprises piezoelectric material arranged such that dynamically changing mechanical strain in the at least one outer wall produces an electrical charge; and 
 a microelectronic circuit enclosed within the casing, the microelectronic circuit being configured to receive and be powered by the electrical charge. 
 
     
     
       2. The micro-electromechanical package of  claim 1 , wherein the microelectronic circuit is mounted on the at least one outer wall of the casing. 
     
     
       3. The micro-electromechanical package of  claim 2 , wherein the at least one outer wall of the casing comprises an inertial mass formed as part of the casing. 
     
     
       4. The micro-electromechanical package of  claim 1 , wherein the piezoelectric material comprises embedded electrode layers configured to collect the electrical charge produced by the piezoelectric material. 
     
     
       5. The micro-electromechanical package of  claim 1 , wherein the casing comprises Aluminum Nitride. 
     
     
       6. The micro-electromechanical package of  claim 1 , wherein the microelectronic circuit comprises at least one of: a power management circuit, a power storage circuit, and a micro-electromechanical sensor circuit. 
     
     
       7. A method of manufacturing a micro-electromechanical (MEMS) package, comprising:
 providing a casing, wherein at least one outer wall of the casing includes a piezoelectric material arranged such that dynamically changing mechanical strain in the at least one outer wall produces an electrical charge; 
 providing a microelectronic circuit enclosed within the casing, the microelectronic circuit being configured to receive and be powered by the electrical charge; and 
 forming the MEMS package via a ceramic multi-layering technique or a polymer molding technique. 
 
     
     
       8. The method of  claim 7 , wherein the microelectronic circuit is mounted on the at least one outer wall of the casing. 
     
     
       9. The method of  claim 8 , wherein the at least one outer wall is formed to include an inertial mass formed as part of the casing. 
     
     
       10. The method of  claim 7 , wherein the piezoelectric material comprises embedded electrode layers configured to collect the electrical charges produced by the piezoelectric material. 
     
     
       11. The method of  claim 7 , wherein the casing is formed to include Aluminum Nitride. 
     
     
       12. The method of  claim 7 , wherein the microelectronic circuit is formed to include at least one of: a power management circuit; a power storage circuit; and a micro-electromechanical sensor circuit. 
     
     
       13. The micro-electromechanical package of  claim 1 , wherein the at least one outer wall of the casing comprises an inertial mass formed as part of the casing.