Sputtering target and method/apparatus for cooling the target
Abstract
A sputtering target includes an outer target tube, an inner support tube supporting a magnet carrier bar extending along substantially the entire length of the inner support tube; and a water cooling circuit including at least one passageway within the inner support tube with an inlet at one end thereof adapted to receive cooling water from an external source, at least one outlet aperture at an opposite end thereof opening to a cooling plenum radially between the inner support tube and the outer target tube; and a baffle comprising a substantially flat plate attached to the inner support tube adjacent the opposite end, the plate extending radially within the plenum between the inner support tube and the outer target tube and having an array of flow apertures therein.
Claims
exact text as granted — not AI-modified1. A sputtering target comprising an outer target tube, an inner support tube supporting a magnet carrier extending along substantially the entire length of the inner support tube; and a water cooling circuit including at least one passageway within said inner support tube with an inlet at one end thereof adapted to receive cooling water from an external source, at least one outlet aperture at an opposite end thereof opening to a cooling chamber radially between said inner support tube and said outer target tube; and a baffle comprising a substantially flat plate attached to said inner support tube adjacent said opposite end, said plate extending radially within said chamber between said inner support tube and said outer target tube and having an array of flow apertures therein.
2. The sputtering target of claim 1 wherein said baffle is substantially circular in shape, with a cut-out portion therein for accommodating said at least one magnet bar.
3. The sputtering target of claim 1 wherein said baffle is formed with a solid, non-apertured band portion adjacent said inner support bar.
4. The sputtering target of claim 3 wherein said solid, non-apertured band portion extends from one side of said cut-out to an opposite side of said cut-out.
5. The sputtering target of claim 1 wherein said inner support tube is concentric with a longitudinal axis of said outer target tube and wherein an outer peripheral edge of said baffle is spaced substantially uniformly from said outer target tube except in said cut-out portion.
6. The sputtering target of claim 1 wherein said at least one outlet aperture comprises plural jets, some of which are arranged to emit water in streams parallel to a longitudinal axis of said target tube, and others of which are arranged to emit water in streams at an acute angle to said longitudinal axis.
7. The sputtering target of claim 1 wherein said outer target tube is rotatable about said inner support tube.
8. The sputtering target of claim 1 wherein said array of flow apertures extends circumferentially about 270° around said inner support tube.
9. The sputtering target of claim 2 wherein said array of flow apertures extends circumferentially about 270° around said inner support tube.
10. A sputtering target comprising an outer target tube, an inner support tube supporting a magnet carrier extending along substantially the entire length of the inner support tube; and a water cooling circuit including at least one passageway within said inner support tube with an inlet at one end thereof adapted to receive cooling water from an external source, at least one outlet aperture at an opposite end thereof opening to a cooling chamber radially between said inner support tube and said outer target tube; and a baffle comprising a substantially flat plate attached to said inner support tube adjacent said opposite end, said plate extending radially within said chamber between said inner support tube and said outer target tube and having an array of flow apertures therein located radially outwardly of a solid, non-apertured band portion adjacent said inner support bar.
11. The sputtering target of claim 10 wherein said solid, non-apertured band portion extends from one side of said cut-out to an opposite side of said cut-out.
12. The sputtering target of claim 11 wherein said inner support tube is concentric with a longitudinal axis of said outer target tube and wherein an outer peripheral edge of said baffle is spaced substantially uniformly from said outer target tube except in said cut-out portion.
13. The sputtering target of claim 10 wherein said at least one outlet aperture comprises plural jet apertures, some of which are arranged to emit water in streams parallel to a longitudinal axis of said target tube, and others of which are arranged to emit water in streams at an acute angle to said longitudinal axis.
14. The sputtering target of claim 10 wherein said outer target tube is rotatable about said inner support tube.
15. The sputtering target of claim 10 wherein said array of flow apertures extends circumferentially about 270° around said inner support tube.
16. A cooling flow baffle for an inner support tube of a sputtering target, the baffle comprising a substantially circular flat plate having a center opening concentric with a center axis of said plate, and a substantially rectangular cut-out communicating with said center opening, said plate formed with an array of flow apertures therein.
17. The baffle of claim 16 wherein said plate has a solid, non-apertured band portion adjacent said center opening.
18. The baffle of claim 17 wherein said solid, non-apertured band extends from one side of said cut-out to an opposite side of said cut-out.
19. The baffle of claim 16 and further comprising attachment components adapted for securing the baffle to the inner support tube.
20. The baffle of claim 18 wherein said array of apertures extends circumferentially about 270° around said inner support tube.Cited by (0)
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