Recyclying faulty multi-die packages

Abstract

The present invention teaches the recycling of a faulty multi-die memory package by isolating the functional part of the package and using it as a smaller memory package.

1. A memory product line, the product line comprising:
 (a) at least two memory products, said at least two memory products having:
 (i) a substantially-equal usable memory size; 
 (ii) a different interface specification for each said at least two memory products; and 
 (iii) at least two memory dies, wherein each of said at least two memory products has a different subset of said at least two memory dies that is not active. 
 
 
   
   
     2. The package of  claim 1 , wherein said at least two memory dies includes flash memory dies. 
   
   
     3. The package of  claim 1 , wherein said at least two memory dies includes NAND-type flash memory dies.