Micro-fluid ejection head structure

Abstract

A method of making a micro-fluid ejection head structure for a micro-fluid ejection device. The method includes applying a removable mandrel material to a semiconductor substrate wafer containing fluid ejection actuators on a device surface thereof. The mandrel material is shaped to provide fluid chamber and fluid channel locations on the substrate wafer. A micro machinable material is applied to the shaped mandrel and the device surface of the wafer to provide a nozzle plate and flow feature layer on the shaped mandrel and wafer. A plurality of nozzle holes are formed in the nozzle plate and flow feature layer. The shaped mandrel material is then removed from the device surface of the substrate wafer to provide fluid chambers and fluid channels in the nozzle plate and flow feature layer.

1. A micro-fluid ejection head structure, comprising:
 a substrate having at least one fluid supply slot formed therein and containing a plurality of fluid ejection actuators on a device surface thereof adjacent at least one edge of the fluid supply slot; 
 a dry-sprayed layer including a negative photoresist layer derived from an epoxy resin, a photoinitiator, and from about 50 to about 97 percent by weight highly volatile carrier fluid, and disposed on the device surface of the substrate containing a plurality of nozzle holes and corresponding fluid chambers and fluid supply channels formed therein, each of the nozzle holes being in fluid flow communication with one of the fluid chambers and one of the fluid supply channels for fluid flow communication with the fluid supply slot, wherein each of the nozzle holes is associated with one of the fluid ejection actuators. 
 
   
   
     2. The micro-fluid ejection head structure of  claim 1  wherein the dry-sprayed layer has a thickness ranging from about 10 to about 80 microns. 
   
   
     3. The micro-fluid ejection head structure of  claim 1 , wherein the dry-sprayed layer comprises two or more dry-sprayed layers. 
   
   
     4. The micro-fluid ejection head structure of  claim 1 , wherein the dry-sprayed layer comprises a negative photoresist material. 
   
   
     5. The micro-fluid ejection head structure of  claim 1 , wherein the nozzle holes and corresponding fluid chambers and fluid supply channels are dry etching in the dry-sprayed layer. 
   
   
     6. The micro-fluid ejection head structure of  claim 1 , wherein the nozzle holes and corresponding fluid chambers and fluid supply channels are formed by a photo imaging and developing technique. 
   
   
     7. The micro-fluid ejection head structure of  claim 1 , wherein the micro-fluid ejection device head structure comprises an inkjet printhead.