Wired circuit board

Abstract

A wired circuit board has a metal supporting board, an insulating layer formed on the metal supporting board, a conductive pattern formed on the insulating layer and having a plurality of wires arranged in mutually spaced-apart relation, and a plurality of semiconductive layers formed on the insulating layer and electrically connected to the metal supporting board and the respective wires. The semiconductive layers are provided independently of each other in correspondence to the respective wires.

1. A wired circuit board comprising:
 a metal supporting board; 
 an insulating layer formed on the metal supporting board; 
 a conductive layer formed on the insulating layer and having a plurality of wires arranged in mutually spaced-apart relation; and 
 a plurality of semiconductive layers formed on the insulating layer and on the respective wires of the conductive pattern, and electrically connected to the metal supporting board and the respective wires, 
 wherein the semiconductive layers include at least one semiconductive layer independently provided for one of the wires, 
 wherein the independently provided semiconductive layers are disposed so as to be spaced-apart in the longitudinal direction of the wired circuit board and wherein each of the semiconductive layers has an overlapping portion in a direction orthogonal to the longitudinal direction of the wired circuit board when projected in the longitudinal direction. 
 
     
     
       2. A wired circuit board comprising:
 a metal supporting board; 
 an insulating layer formed on the metal supporting board; 
 a conductive pattern formed on the insulating layer and having a plurality of wires arranged in mutually spaced-apart relation; and 
 a plurality of semiconductive layers formed on the insulating layer and electrically connected to the metal supporting board and the respective wires, wherein 
 the semiconductive layers are provided independently of each other in correspondence to the respective wires; 
 wherein a plurality of openings are formed in the insulating layer to extend through in a thickness direction in correspondence to the respective wires, and 
 a plurality of ground connection portions are formed on the metal supporting board exposed from the respective openings in contact relation with the metal supporting board and the respective semiconductive layers.