Light emitting assembly and backlight device employing the same

Abstract

A light emitting assembly ( 50 ) includes a metal circuit board ( 54 ) having a first surface and an opposite second surface, a light emitting module ( 52 ) mounted on the first surface of the metal circuit board, and a cooling module ( 58 ) attached to the second surface of the metal circuit board. A backlight device ( 90 ) includes a reflection plate ( 91 ), a diffuser sheet ( 93 ) disposed on the reflection plate and a plurality of light emitting assemblies ( 92 ) regularly arranged between the reflection plate and the diffuser sheet. Each light emitting assembly includes a metal circuit board ( 922 ) having a first surface and an opposite surface, a light emitting module ( 921 ) mounted on the first surface of the metal circuit board and a cooling module ( 923 ) attached to the second surface of the metal circuit board. The present light emitting assembly and backlight device can increase heat abstraction efficiency.

1. A light emitting assembly, comprising:
 a metal circuit board having a first surface and an opposite second surface; 
 a light emitting module mounted on the first surface of the metal circuit board, P the light emitting module comprising a plurality of light emitting diodes each having a positive electrode and a negative electrode, the positive electrode of each light emitting diode being connected to the negative electrode of a neighboring light emitting diode, the negative electrode of the light emitting diode being connected to the positive electrode of the neighboring light emitting diode, the positive electrodes and the negative electrodes of the plurality of light emitting diodes being respectively formed on two opposite sides of the light emitting module, wherein the plurality of light emitting diodes comprising at least one red light emitting diode, at least one green light emitting diode and at least one blue light emitting diode such that mixed light emitted therefrom appears to be white light; and 
 a cooling module attached to the second surface of the metal circuit board. 
 
   
   
     2. The light emitting assembly as claimed in  claim 1 , wherein the cooling module comprises a heat dissipation device having a number of cooling fins. 
   
   
     3. The light emitting assembly as claimed in  claim 2 , wherein the cooling fins are comprised of a heat conductive material. 
   
   
     4. The light emitting assembly as claimed in  claim 3 , wherein the heat conductive material is selected from the group consisting of copper, aluminum and a combination alloy thereof. 
   
   
     5. The light emitting assembly as claimed in  claim 1 , wherein the cooling module further comprises one of a water cooling device or at least a heat pipe. 
   
   
     6. The light emitting assembly as claimed in  claim 1 , wherein the metal circuit board is comprised of a heat conductive material. 
   
   
     7. The light emitting assembly as claimed in  claim 6 , wherein the heat conductive material is selected from the group consisting of copper, aluminum, and a combination alloy thereof. 
   
   
     8. The light emitting assembly as claimed in  claim 1 , wherein the plurality of light emitting diodes is configured in a line in an order selected from the group consisting of G-R-B-R-G, R-G-B-G-R, G-R-B-B-R-G, R-G-B-B-G-R, G-R-B-G-G-B-R-G, G-R-B-B-R-G-G-R-B, wherein, R represents a red light emitting diode, G represents a green light emitting diode, and B represents a blue light emitting diode. 
   
   
     9. The light emitting assembly as claimed in  claim 1 , wherein the plurality of light emitting diodes is arranged in one of curves and circles in an order selected from the group consisting of G-R-B-R-G, R-G-B-G-R, G-R-B-B-R-G, R-G-B-B-G-R, G-R-B-G-G-B-R-G, G-R-B-B-R-G-G-R-B, wherein, R represents a red light emitting diode, G represents a green light emitting diode, and B represents a blue light emitting diode. 
   
   
     10. A backlight device, comprising:
 a reflection plate; 
 a diffuser sheet disposed on the reflection plate; and 
 a plurality of light emitting assemblies regularly arranged between the reflection plate and the diffuser sheet, each light emitting assembly comprising a metal circuit board having a first surface and an opposite second surface, a light emitting module mounted on the first surface of the metal circuit board, the light emitting module comprising a plurality of light emitting diodes each having a positive electrode and a negative electrode, the positive electrode of each light emitting diode being connected to the negative electrode of a neighboring light emitting diode, the negative electrode of the light emitting diode being connected to the positive electrode of the neighboring light emitting diode, the positive electrodes and the negative electrodes of the plurality of light emitting diodes being respectively formed on two opposite sides of the light emitting modules wherein the plurality of light emitting diodes comprising at least one red light emitting diode, at least one green light emitting diode and at least one blue light emitting diode such that mixed light emitted therefrom appears to be white light; and a cooling module attached to the second surface of the metal circuit board. 
 
   
   
     11. The backlight device as claimed in  claim 10 , wherein the cooling system comprises a heating dissipation device having a number of cooling fins. 
   
   
     12. The backlight device as claimed in  claim 11 , wherein the cooling fins and the metal circuit board are comprised of a heat conductive material. 
   
   
     13. The backlight device as claimed in  claim 12 , wherein the heat conductive material is selected from the group consisting of copper, aluminum and a combination alloy thereof. 
   
   
     14. The backlight device as claimed in  claim 10 , wherein the plurality of light emitting diodes is configured in a line in an order selected from the group consisting of G-R-B-R-G, R-G-B-G-R, G-R-B-B-R-G, R-G-B-B-G-R, G-R-B-G-G-B-R-G, G-R-B-B-R-G-G-R-B, wherein, R represents a red light emitting diode, G represents a green light emitting diode, and B represents a blue light emitting diode. 
   
   
     15. The light emitting modules as claimed in  claim 10 , wherein the plurality of light emitting diodes is arranged in one of a curve and a circle in an order selected from the group consisting of G-R-B-R-G, R-G-B-G-R, G-R-B-B-R-G, R-G-B-B-G-R, G-R-B-G-G-B-R-G, G-R-B-B-R-G-G-R-B, wherein, R represents a red light emitting diode, G represents a green light emitting diode, and B represents a blue light emitting diode.