Sensor package

Abstract

A sensor package includes an image sensing chip having a front surface, a plurality of bumps, a glass cover plate, and a connector. The plurality of bumps are formed on the front surface, and are electrically connected to the image sensing chip. The glass cover plate has a bottom surface facing the front surface, and the glass cover plate has a plurality of transparent conductive wires formed on the bottom surface. A terminal of each of the transparent conductive wires is electrically connected to a respective bump, and another terminal of each of the transparent conductive wires extends out of an orthogonal projection area of the image sensing chip on the bottom surface. The connector is electrically connected to the another terminal of each of the transparent conductive wires.

1. A sensor package, comprising:
 an image sensing chip having a front surface; 
 a plurality of bumps being formed on the front surface, and electrically connected to the image sensing chip; 
 a glass cover plate having a bottom surface facing the front surface, the glass cover plate having a plurality of transparent conductive wires formed on the bottom surface, a terminal of each of the transparent conductive wires being electrically connected to a respective bump, another terminal of each of the transparent conductive wires extending out of an orthogonal projection area of the image sensing chip on the bottom surface; and 
 a connector being electrically connected to the another terminal of each of the transparent conductive wires. 
 
   
   
     2. The sensor package as claimed in  claim 1 , wherein the image sensing chip has a sensing area for converting light signals into electrical signals on the front surface. 
   
   
     3. The sensor package as claimed in  claim 2 , further comprising a first insulated adhesive being arranged round the sensing area, and the glass cover plate, and wherein the first insulated adhesive, and the plurality of bumps cooperatively seal the sensing area. 
   
   
     4. The sensor package as claimed in  claim 2 , wherein the plurality of transparent conductive wires are formed on the bottom surface so that some of the conductive wires go across a part of the bottom surface that faces toward the sensing area. 
   
   
     5. The sensor package as claimed in  claim 1 , wherein the connector includes a plurality of connecting pads electrically connected to the plurality of transparent conductive wires respectively. 
   
   
     6. The sensor package as claimed in  claim 5 , further comprising a second insulated adhesive filled in spaces between the plurality of connecting pads. 
   
   
     7. The sensor package as claimed in  claim 1 , wherein a material of the plurality of transparent conductive wires is indium tin oxide or carbon nanotubes. 
   
   
     8. The sensor package as claimed in  claim 1 , wherein the plurality of bumps is metallic bumps.