Semiconductor device

Abstract

A logic circuit in a system LSI is provided with a power switch so as to cut off the switch at the time of standby, reducing leakage current. At the same time, an SRAM circuit of the system LSI controls a substrate bias to reduce leakage current.

1. A semiconductor device comprising:
 a static memory cell array including arrayed SRAM cells; 
 a first peripheral circuit which drives word lines of the static memory cells; 
 a second peripheral circuit which drives bit lines of the static memory cells; 
 a first voltage source line which supplies a first voltage; 
 a second voltage source line which supplies a second voltage lower than the first voltage; 
 a first MIS transistor; and 
 a second MIS transistor, 
 wherein the first peripheral circuit is coupled to the first voltage source line through a source-drain path of the first MIS transistor, and 
 wherein the second peripheral circuit is coupled to the second voltage source line through a source-drain path of the second MIS transistor. 
 
     
     
       2. A semiconductor device according to  claim 1 ,
 wherein the first peripheral circuit is coupled to the second voltage source line; and 
 wherein the second peripheral circuit is coupled to the first voltage source line. 
 
     
     
       3. A semiconductor device according to  claim 1 ,
 wherein the static memory cell array is coupled to the first voltage source line and the second voltage source line. 
 
     
     
       4. A semiconductor device according to  claim 1 ,
 wherein the first peripheral circuit is coupled to the second voltage source line, 
 wherein the second peripheral circuit is coupled to the first voltage source line, and 
 wherein the static memory cell array is coupled to the first voltage source line and the second voltage source line. 
 
     
     
       5. A semiconductor device according to  claim 4 ,
 wherein the second peripheral circuit includes a bit line pre-charge circuit, a read amplifier, a write amplifier and a column decoder. 
 
     
     
       6. A semiconductor device according to  claim 5 ,
 wherein the first peripheral circuit includes a memory controller, a row decoder, and a word driver. 
 
     
     
       7. A semiconductor device according to  claim 1 ,
 wherein a conduction type of the first MIS transistor is different from a conduction type of the second MIS transistor. 
 
     
     
       8. A semiconductor device according to  claim 7 ,
 wherein the first MIS transistor is a P-channel type MIS transistor, and 
 wherein the second MIS transistor is an N-channel type MIS transistor. 
 
     
     
       9. A semiconductor device according to  claim 8 , further comprising:
 a logic circuit including a plurality of MIS transistors; and 
 a third MIS transistor; 
 wherein the logic circuit is coupled to the second voltage source line through a source-drain path of the third MIS transistor, and 
 wherein the logic circuit is coupled to the first voltage source line. 
 
     
     
       10. A semiconductor device according to  claim 9 , further comprising:
 an input circuit which receives standby signal; and 
 a control circuit which controls the first MIS transistor, the second MIS transistor and the third MIS transistor according to the standby signal.