Probe card assembly and method of attaching probes to the probe card assembly

Abstract

A probe card assembly is provided. The probe card assembly includes a substrate layer defining a plurality of apertures and a plurality of probes. Each of the probes has a base and a tip. The base of each probe is configured to be at least partially inserted within one of the plurality of apertures.

1. An assembly configured to be included in a probe card assembly, the assembly comprising:
 a space transformer comprising a multilayer ceramic substrate; 
 an exterior layer, said exterior layer defining a plurality of apertures that correspond to locations of a plurality of probes attached to and aligned on a detachable strip prior to insertion of the plurality of the probes with the assembly, each of the apertures being sized and shaped to receive, within the aperture, the base of a probe of the probe card assembly when the probe is at least partially inserted into the aperture; and 
 an intermediate layer, said intermediate layer located between the space transformer and the exterior layer. 
 
   
   
     2. The assembly of  claim 1 , wherein the exterior layer comprises a thin film of polyimide. 
   
   
     3. The assembly of  claim 1 , wherein a predetermined amount of solder is placed into each aperture to attach the base of each probe to the exterior layer. 
   
   
     4. The assembly of  claim 1 , wherein each of the plurality of apertures is a conductive via hole. 
   
   
     5. The assembly of  claim 1 , wherein each of the plurality of apertures extends partially into but not through the exterior layer. 
   
   
     6. The assembly of  claim 1 , wherein the exterior layer comprises a thickness of about from 150 μm to about 250 μm. 
   
   
     7. The assembly of  claim 1 , wherein each of the plurality of apertures extends through the exterior layer and the intermediate layer and abuts the space transformer, through which the plurality of apertures do not extend. 
   
   
     8. The assembly of  claim 1 , wherein each of the plurality of apertures extends through the exterior layer and abuts the intermediate layer, through which the plurality of apertures do not extend. 
   
   
     9. The assembly of  claim 1 , wherein the intermediate layer comprises three separate layers of polymer. 
   
   
     10. The assembly of  claim 9 , wherein each layer of polymer is of a thickness of about from 22 μm to about 33 μm, with the intermediate layer having a total thickness of about from 66 μm to about 100 μm. 
   
   
     11. The assembly of  claim 1 , wherein the intermediate layer is used to route signals, power, and ground traces or planes. 
   
   
     12. The assembly of  claim 1 , wherein the plurality of probes are further attached to a template substrate prior to insertion of the plurality of the probes with the assembly. 
   
   
     13. The assembly of  claim 1 , wherein an interior surface of each aperture is plated in solder to attach the base of each probe to the exterior layer. 
   
   
     14. The assembly of  claim 3 , wherein the predetermined amount of solder is sufficient to at least substantially fill each aperture when the base of each probe is inserted into the apertures. 
   
   
     15. The assembly of  claim 1 , wherein the exterior layer comprises a thin film of liquid crystal polymer. 
   
   
     16. The assembly of  claim 1 , wherein the exterior layer comprises a ceramic material. 
   
   
     17. The assembly of  claim 1 , wherein the plurality of apertures are formed using laser drilling.