Methods for manufacturing miniature circuitry and inductive components

Abstract

A method for making plural plated through holes in a single circuit board via is provided. The method includes plating copper in the walls of said circuit board via to form a first plated through hole and applying a thin layer of first adhesive promotor to the surface of said plated via. The method further includes vacuum depositing an organic layer having a high dielectric strength unto said layer of first adhesive promoter and applying a second layer of adhesive promoter over said organic layer. The method even further includes plating copper over said second layer of adhesive promoter to form a second plated through hole in said circuit board via.

1. A method for making plural plated through hole conductors in a circuit board via comprising
 plating a first layer in the walls of a circuit board via to, said first layer in said circuit board via comprises a first plated through hole conductor, 
 applying a second layer in said circuit board via bonded to said first layer, the second layer in said circuit board comprises a first adhesive, 
 vacuum depositing a third layer in said circuit board via bonded to said second layer, the third layer in said circuit board via comprises an organic layer having a relatively high dielectric strength, 
 applying a fourth layer in said circuit board via bonded to said third layer, the fourth layer in said circuit board comprises a second adhesive, and 
 plating a first layer in said circuit board via bonded to said fourth layer, said fifth layer comprises a second plated through hole conductor electrically isolated from said first plated through hole conductor in said circuit board via. 
 
     
     
       2. The method of  claim 1  wherein said first adhesive promoter is applied by a PECVD process (Plasma Enhanced Chemical Vapor Deposition). 
     
     
       3. The method of  claim 1  wherein said first adhesive promoter is Silane, Carboxyl or Silane and Carboxyl. 
     
     
       4. The method of  claim 1  wherein said first adhesive promoter is applied by dipping the through holes in the adhesive promoter. 
     
     
       5. The method of  claim 1  wherein said second adhesive is applied by a PECVD process. 
     
     
       6. The method of  claim 5  wherein said second adhesive promoter is a Carboxl or Silane gas phase chemical reaction. 
     
     
       7. The method of  claim 1  wherein said organic layer is a vacuum deposited. 
     
     
       8. The method of  claim 7  wherein said organic layer is a parylene coating.