Electric power converter and mounting structure of semiconductor device

Abstract

An electric power converter has a main circuit section including a semiconductor module and a cooling device; a control circuit substrate section electrically connected to a signal terminal of the semiconductor module, and having a control circuit; and a power wiring section connected to a main electrode terminal of the semiconductor module. The main circuit section is interposed between the control circuit substrate section and the power wiring section.

1. A mounting structure of a semiconductor device, the structure comprising:
 a semiconductor module including a semiconductor element for supplying electricity, a first and a second electrode plates disposed on both sides of the semiconductor element, a connecting terminal connected to a control circuit for controlling the semiconductor element, and a resin mold having electric insulation for sealing the semiconductor element and the first and the second electrode plates; and 
 a first and a second holding members having electric conductivity for holding the semiconductor module from both sides of the semiconductor module through a first and a second insulation members as a dielectric member, wherein 
 the first or second electrode plate, the first or second holding member, the first or second insulation member provide a bypass capacitor for reducing noise. 
 
   
   
     2. The mounting structure of a semiconductor device according to  claim 1 , wherein
 a part of each of the first and the second electrode plates is exposed, and 
 each of the first and the second insulation members is an insulation plate disposed between the exposed part of the first or the second electrode plate and the first or the second holding member. 
 
   
   
     3. The mounting structure of a semiconductor device according to  claim 1 , wherein
 a part of each of the first and the second electrode plates is exposed, and 
 each of the first and the second insulation members is an insulation coating film integrated with the resin mold and covering the exposed part of the first or the second electrode plate. 
 
   
   
     4. The mounting structure of a semiconductor device according to  claim 1 , wherein
 a part of each of the first and the second electrode plates is exposed, and 
 each of the first and the second insulation members is an insulation coating film integrated with the resin mold and facing the exposed part of the first or the second electrode plate. 
 
   
   
     5. The mounting structure of a semiconductor device according to  claim 2 , wherein the first and the second holding members are grounded. 
   
   
     6. The mounting structure of a semiconductor device according to  claim 2 , wherein
 cooling medium having electric conductivity flows inside of the first and the second holding members, and 
 the cooling medium is grounded.